18486684. PATTERNING MATERIAL, PATTERNING COMPOSITION, AND PATTERN FORMING METHOD simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
PATTERNING MATERIAL, PATTERNING COMPOSITION, AND PATTERN FORMING METHOD
Organization Name
Inventor(s)
PATTERNING MATERIAL, PATTERNING COMPOSITION, AND PATTERN FORMING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18486684 titled 'PATTERNING MATERIAL, PATTERNING COMPOSITION, AND PATTERN FORMING METHOD
Simplified Explanation
The patent application relates to a patterning material, composition, and method for forming patterns. The material includes a metal-oxygen cluster framework, a radiation-sensitive organic ligand, and a second ligand. The organic ligand coordinates with a metal through a coordination atom, which can be an oxygen, sulfur, selenium, nitrogen, or phosphorus atom. The ligand can be monodentate or polydentate with a denticity of two or more. The second ligand is an inorganic ion or a coordination group.
- The patent application describes a material and method for creating patterns.
- The material includes a metal-oxygen cluster framework, a radiation-sensitive organic ligand, and a second ligand.
- The organic ligand coordinates with a metal through a coordination atom, which can be an oxygen, sulfur, selenium, nitrogen, or phosphorus atom.
- The ligand can be monodentate or polydentate with a denticity of two or more.
- The second ligand is an inorganic ion or a coordination group.
Potential applications of this technology:
- Patterning materials for use in various industries such as electronics, optics, and nanotechnology.
- Fabrication of micro- and nano-scale devices.
- Creation of intricate patterns for decorative purposes.
Problems solved by this technology:
- Provides a precise and controlled method for creating patterns.
- Offers a versatile material that can be tailored for specific applications.
- Enables the fabrication of complex structures with high resolution.
Benefits of this technology:
- Allows for the production of patterns with high precision and accuracy.
- Offers flexibility in design and customization.
- Provides a cost-effective and efficient method for patterning materials.
Original Abstract Submitted
This application relates to a patterning material, a patterning composition, and a pattern forming method. The patterning material in this application includes a metal-oxygen cluster framework, a radiation-sensitive organic ligand, and a second ligand. The radiation-sensitive organic ligand coordinates with a metal M through a coordination atom. The coordination atom is at least one of: an oxygen atom, a sulfur atom, a selenium atom, a nitrogen atom, or a phosphorus atom. The radiation-sensitive organic ligand is a monodentate ligand or a polydentate ligand with a denticity of two or more. The second ligand is an inorganic ion or a coordination group.
