18483281. SEMICONDUCTOR PACKAGE simplified abstract (Huawei Technologies Co., Ltd.)

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SEMICONDUCTOR PACKAGE

Organization Name

Huawei Technologies Co., Ltd.

Inventor(s)

[[:Category:Jürgen H�gerl of Munich (DE)|Jürgen H�gerl of Munich (DE)]][[Category:Jürgen H�gerl of Munich (DE)]]

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18483281 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The semiconductor package described in the patent application includes a first substrate, a semiconductor chip, a leadframe with at least one lead, and an encapsulant. The encapsulant has different portions extending in different planes to optimize heat dissipation and maintain a minimum distance between the encapsulant and the lead.

  • The encapsulant has different portions extending in different planes to optimize heat dissipation.
  • The dimensions of the different portions are designed to maintain a minimum distance between the encapsulant and the lead.
  • The first substrate and the encapsulant form a lower heat dissipation surface of the package.

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      1. Potential Applications
  • Semiconductor packaging for electronic devices
  • Heat dissipation optimization in semiconductor devices
      1. Problems Solved
  • Efficient heat dissipation in semiconductor packages
  • Maintaining a minimum distance between encapsulant and lead for safety and performance
      1. Benefits
  • Improved thermal management in semiconductor devices
  • Enhanced reliability and performance of electronic components


Original Abstract Submitted

A semiconductor package includes a first substrate, a semiconductor chip, a leadframe comprising at least one lead, and an encapsulant. A lower main face of the encapsulant includes a first portion extending in a first plane, a second portion extending in a second plane, a third portion extending in a first transition zone between the first plane and the second plane, and a fourth portion extending in a second transition zone between the second plane and the at least one lead. Both the first portion of the encapsulant and a lower main face of the first substrate extend in the first plane forming a lower heat dissipation surface of the package. The second portion, the third portion and the fourth portion of the encapsulant are dimensioned so as to keep a first predefined minimum distance between the first portion of the encapsulant and the at least one lead.

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