18479767. SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES simplified abstract (Meta Platforms Technologies, LLC)

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES

Organization Name

Meta Platforms Technologies, LLC

Inventor(s)

Cameron Elliot Glasscock of Redmond WA (US)

Zhenzhen Shen of Kirkland WA (US)

Felippe Jose Pavinatto of Lynnwood WA (US)

Omar Awartani of Redmond WA (US)

Allison Tuuri of Seattle WA (US)

Lichuan Chen of Kirkland WA (US)

Aleksey Reiderman of Erie CO (US)

Marcos Antonio Santana Andrade, Jr. of Seattle WA (US)

SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18479767 titled 'SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES

Simplified Explanation

The present disclosure describes a system for producing an interconnect in an electronic device using a deformable substrate with a circuit, including a channel, first and second circuit components, and metal materials.

• Deformable substrate with circuit and channel
• First and second circuit components adjacent to different portions of the substrate
• First metal material overlaying a portion of the substrate and channel
• Second metal material interfacing with the first metal material within the channel

Potential Applications

The technology described in this patent application could be applied in the manufacturing of flexible electronic devices, such as wearable technology, flexible displays, and bendable sensors.

Problems Solved

This technology solves the problem of creating reliable interconnects in deformable electronic devices, where traditional rigid interconnects may fail due to bending or stretching of the device.

Benefits

The benefits of this technology include increased durability and flexibility of electronic devices, improved performance under deformation, and potentially lower manufacturing costs compared to traditional interconnect methods.

Potential Commercial Applications

• Flexible electronics industry
• Wearable technology market
• Medical devices with flexible components

Possible Prior Art

One possible prior art could be the use of flexible printed circuit boards (PCBs) in electronic devices to allow for some degree of deformation without compromising functionality.

What materials are used for the first and second metal materials in the interconnect system described in the patent application?

The first metal material is formed overlaying a portion of the deformable substrate, while the second metal material interfaces with the first metal material within the channel.

How does the deformable substrate contribute to the functionality of the interconnect system in the electronic device?

The deformable substrate allows for flexibility and deformation of the electronic device without compromising the integrity of the interconnect system, ensuring reliable performance under various conditions.

Original Abstract Submitted

The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.