18477910. SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR MANUFACTURING EQUIPMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR MANUFACTURING EQUIPMENT
Organization Name
Inventor(s)
SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18477910 titled 'SEMICONDUCTOR MANUFACTURING EQUIPMENT
Simplified Explanation
The patent application describes semiconductor manufacturing equipment with a bonding head, a head heater, negative pressure channels, and a bonding tool for thermal compression.
- The bonding head includes a head heater at the bottom with a thermal compression surface.
- The negative pressure channels are recessed from the thermal compression surface and have holes for suction.
- The bonding tool has grooves on the first surface to contact the thermal compression surface and a second surface to contact the semiconductor chip.
Potential Applications
This technology could be used in semiconductor manufacturing processes that require precise bonding of chips to substrates.
Problems Solved
This technology helps to ensure proper thermal compression bonding between semiconductor chips and substrates, improving the overall quality and reliability of the final product.
Benefits
The equipment allows for efficient and reliable bonding of semiconductor chips, leading to improved performance and longevity of electronic devices.
Potential Commercial Applications
One potential commercial application of this technology is in the production of advanced electronic devices such as smartphones, tablets, and computers.
Possible Prior Art
One possible prior art for this technology could be similar semiconductor manufacturing equipment with bonding heads and head heaters, but without the specific design features described in this patent application.
Unanswered Questions
How does this technology compare to existing bonding methods in terms of efficiency and reliability?
This article does not provide a direct comparison between this technology and existing bonding methods, leaving uncertainty about its advantages over current practices.
What are the potential limitations or challenges in implementing this technology on a large scale in semiconductor manufacturing facilities?
The article does not address any potential limitations or challenges that may arise when implementing this technology on a large scale, leaving room for further investigation into its scalability and practicality.
Original Abstract Submitted
Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.
