18475290. INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT simplified abstract (Samsung Electronics Co., Ltd.)

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INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Youngrok Park of Suwon-si (KR)

Hoyoung Tang of Suwon-si (KR)

Taehyung Kim of Suwon-si (KR)

Sangshin Han of Suwon-si (KR)

INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18475290 titled 'INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT

Simplified Explanation

The abstract describes an integrated circuit with a bit cell array and a peripheral region containing various devices and circuits.

  • The integrated circuit includes a bit cell array with multiple bit cells and a peripheral region with a peripheral circuit.
  • The peripheral region consists of devices on a substrate, patterns providing voltage to devices, power lines under the substrate, and vias connecting patterns to power lines.

Potential Applications

This technology could be applied in:

  • Memory chips
  • Microprocessors
  • Graphics processing units

Problems Solved

This technology helps in:

  • Improving circuit integration
  • Enhancing data storage capacity
  • Increasing processing speed

Benefits

The benefits of this technology include:

  • Higher performance
  • Greater efficiency
  • Enhanced functionality

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Consumer electronics
  • Telecommunications
  • Automotive industry

Possible Prior Art

One possible prior art for this technology could be:

  • Previous integrated circuit designs with similar peripheral regions and bit cell arrays

Unanswered Questions

How does this technology impact power consumption in integrated circuits?

This article does not delve into the specific effects of this technology on power consumption within integrated circuits. Further research and analysis would be needed to understand the implications in this area.

What are the potential challenges in manufacturing integrated circuits with such complex peripheral regions?

The article does not address the potential manufacturing challenges that may arise when implementing this technology. Understanding the production hurdles and solutions would be crucial for successful adoption in the industry.


Original Abstract Submitted

An integrated circuit may include a bit cell array including a plurality of bit cells and a peripheral region including a peripheral circuit. The peripheral region may include a plurality of devices over a substrate, at least one pattern configured to provide a first voltage to at least one of the plurality of devices, at least one power line extending under the substrate, and at least one first via passing through the substrate in a vertical direction in the peripheral region and electrically connecting the at least one pattern to the at least one power line.