18470160. SUBSTRATE TREATING APPARATUS simplified abstract (SCREEN Holdings Co., Ltd.)

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SUBSTRATE TREATING APPARATUS

Organization Name

SCREEN Holdings Co., Ltd.

Inventor(s)

Takashi Izuta of Kyoto (JP)

SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18470160 titled 'SUBSTRATE TREATING APPARATUS

Simplified Explanation

The substrate treating apparatus described in the patent application aims to transport substrates reliably while reducing manufacturing costs by revising the construction of the apparatus, which includes a batch-type module and a single-wafer-type module.

  • The apparatus is designed to transport substrates reliably.
  • The construction of the apparatus is revised to include a batch-type module and a single-wafer-type module.
  • The goal is to suppress manufacturing costs while maintaining efficiency.

Potential Applications

The technology can be applied in semiconductor manufacturing, solar panel production, and other industries that require precise substrate treatment processes.

Problems Solved

1. Ensures reliable transportation of substrates. 2. Reduces manufacturing costs associated with substrate treatment processes.

Benefits

1. Improved reliability in substrate transportation. 2. Cost savings in manufacturing processes. 3. Enhanced efficiency in substrate treatment.

Potential Commercial Applications

Optimizing substrate treatment processes in semiconductor fabrication plants. Enhancing production efficiency in solar panel manufacturing facilities.

Possible Prior Art

Prior art may include existing substrate treating apparatus with similar functionalities, but the specific combination of batch-type and single-wafer-type modules may be unique to this patent application.

Unanswered Questions

How does the revised construction of the apparatus improve substrate transportation reliability?

The patent application mentions revising the construction of the apparatus, but it does not provide specific details on how this revision enhances substrate transportation reliability.

What are the exact cost-saving measures implemented in the revised construction of the apparatus?

While the patent application states that manufacturing costs are suppressed, it does not elaborate on the specific cost-saving measures incorporated in the revised construction of the apparatus.


Original Abstract Submitted

Provided is a substrate treating apparatus can be provided that transports substrates reliably and has suppressed manufacturing cost by revising a construction of an apparatus including a batch-type module and a single-wafer-type module.