18469111. SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Organization Name
Inventor(s)
HYEONSEOK Lee of SUWON-SI (KR)
HYEONJEONG Hwang of SUWON-SI (KR)
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18469111 titled 'SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution substrate, a sub-package, a semiconductor chip, a heat dissipation structure, and an encapsulant. The redistribution substrate contains a redistribution structure, and the semiconductor chip is positioned next to the sub-package. The encapsulant covers the sub-package, semiconductor chip, and heat dissipation structure.
- The semiconductor package includes a redistribution substrate with a redistribution structure.
- A sub-package and a semiconductor chip are positioned on the redistribution substrate.
- A heat dissipation structure surrounds the sub-package and semiconductor chip.
- An encapsulant covers the sub-package, semiconductor chip, and heat dissipation structure.
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics, telecommunications, automotive, and aerospace for advanced semiconductor packaging solutions.
Problems Solved
This technology addresses the challenges of thermal management, electrical connectivity, and protection of semiconductor components in a compact and efficient manner.
Benefits
The benefits of this technology include improved thermal performance, enhanced electrical connections, increased reliability, and overall miniaturization of semiconductor packages.
Potential Commercial Applications
One potential commercial application of this technology could be in the development of high-performance computing devices, advanced sensors, and power electronics systems.
Possible Prior Art
Prior art in semiconductor packaging includes traditional methods such as wire bonding, flip-chip bonding, and through-silicon vias. However, the specific combination of features described in this patent application may offer unique advantages in terms of thermal management and overall performance.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness?
This article does not provide information on the cost implications of implementing this technology compared to traditional semiconductor packaging methods.
What are the environmental implications of using this technology in terms of material usage and recyclability?
The article does not address the environmental impact of the materials used in this semiconductor packaging technology or the recyclability of the components.
Original Abstract Submitted
A semiconductor package includes a redistribution substrate, a sub-package disposed on the redistribution substrate, a semiconductor chip disposed on the redistribution substrate, a heat dissipation structure disposed on the redistribution substrate and surrounding the sub-package and the semiconductor chip, and an encapsulant. The redistribution substrate includes a redistribution structure. The semiconductor chip is positioned side-by-side with the sub-package. The encapsulant encapsulates the sub-package, the semiconductor chip, and the heat dissipation structure.
