18467706. SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD simplified abstract (SCREEN Holdings Co., Ltd.)
Contents
- 1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
Organization Name
Inventor(s)
Kazuki Nakamura of Kyoto-shi (JP)
Yoshifumi Okada of Kyoto-shi (JP)
Nobuaki Okita of Kyoto-shi (JP)
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18467706 titled 'SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
Simplified Explanation
The substrate cleaning apparatus described in the patent application includes an upper holding device that holds the outer peripheral end of a substrate, and a lower surface brush that contacts the lower surface of the substrate to clean it. The lower surface brush moves in a specific sequence to clean the lower surface effectively.
- The upper holding device secures the substrate in place during the cleaning process.
- The lower surface brush first contacts a partial region of the lower surface to start cleaning the central region of the substrate.
- The lower surface brush then moves to clean the central region of the lower surface.
- After cleaning the central region, the lower surface brush moves away from another partial region of the lower surface.
- The partial regions that the lower surface brush contacts do not overlap with the central region being cleaned.
Potential Applications
The technology described in this patent application could be used in industries that require precise cleaning of substrates, such as semiconductor manufacturing, optical lens production, and solar panel fabrication.
Problems Solved
This technology solves the problem of efficiently cleaning the lower surface of a substrate without causing damage or leaving residue behind. It ensures thorough cleaning of the central region while avoiding overlapping with other areas.
Benefits
The benefits of this technology include improved cleaning efficiency, reduced risk of damage to substrates, and a more controlled cleaning process. It can lead to higher quality end products and increased productivity.
Potential Commercial Applications
Potential commercial applications of this technology include automated substrate cleaning systems for manufacturing facilities, cleaning equipment for research laboratories, and specialized cleaning tools for industries that require precise substrate cleaning.
Possible Prior Art
One possible prior art for this technology could be automated substrate cleaning systems used in semiconductor manufacturing. These systems may have similar features but may not have the specific sequence of movements described in this patent application.
Unanswered Questions
How does the upper holding device ensure the substrate remains stable during the cleaning process?
The patent application mentions an upper holding device, but it does not provide details on how this device secures the substrate. Further information on the mechanism of the upper holding device would be helpful.
What materials are used in the lower surface brush to ensure effective cleaning without causing damage to the substrate?
The patent application does not specify the materials used in the lower surface brush. Understanding the composition of the brush could provide insights into its cleaning capabilities and durability.
Original Abstract Submitted
A substrate cleaning apparatus includes an upper holding device holding an outer peripheral end of a substrate, and a lower surface brush contacting a lower surface of the substrate to clean the lower surface. The lower surface brush moves from a state of being separated from the lower surface to contact a first partial region of the lower surface when cleaning of a lower surface central region of the substrate is started. Then, the lower surface brush moves into contact with the lower surface central region on the lower surface. The lower surface brush moves from a state of being in contact with the lower surface to be separated from a second partial region of the lower surface when cleaning of the lower surface central region is completed. At least one of the first partial region and the second partial region does not overlap the lower surface central region.
