18467071. BONDING APPARATUS AND BONDING METHOD simplified abstract (TOKYO ELECTRON LIMITED)
Contents
- 1 BONDING APPARATUS AND BONDING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDING APPARATUS AND BONDING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
BONDING APPARATUS AND BONDING METHOD
Organization Name
Inventor(s)
Hideyuki Fukushima of Koshi City (JP)
Manju Choi of Hwaseong-si (KR)
BONDING APPARATUS AND BONDING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18467071 titled 'BONDING APPARATUS AND BONDING METHOD
Simplified Explanation
The bonding apparatus described in the patent application utilizes a control system to attract a second substrate towards a first substrate during the bonding process. The control system adjusts the attracting pressure distribution on multiple regions of the substrates to ensure a successful bond.
- The apparatus includes a first holder, a second holder, an attracting pressure generator, a pushing member, and a controller.
- The controller adjusts the attracting pressure distribution from a beginning attracting pressure to a progress attracting pressure during the bonding process.
- The progress attracting pressure distribution is created by changing the attracting pressures on multiple regions of the substrates.
- This technology optimizes the bonding process by controlling the pressure distribution for a more efficient and effective bond.
Potential Applications
This technology can be applied in semiconductor manufacturing, microelectronics assembly, and medical device production for precise and reliable bonding processes.
Problems Solved
This technology solves the problem of inconsistent bonding results due to variations in pressure distribution during the bonding process.
Benefits
- Improved bonding quality - Enhanced bond strength - Increased production efficiency
Potential Commercial Applications
"Advanced Pressure Control System for Bonding Apparatus in Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to pressure control systems in bonding apparatuses, but specific examples are not provided in the patent application.
Unanswered Questions
How does the controller determine the optimal pressure distribution for bonding?
The patent application does not specify the exact method or algorithm used by the controller to adjust the pressure distribution during the bonding process.
What materials are suitable for bonding using this apparatus?
The patent application does not mention specific materials or substrates that can be bonded using this technology.
Original Abstract Submitted
A bonding apparatus includes a first holder, a second holder, an attracting pressure generator, a pushing member and a controller. The controller attracts a second substrate with a beginning attracting pressure distribution set on multiple regions, when a pressurization of a first substrate by the pushing member is begun. The controller performs a control of performing a switchover from the beginning attracting pressure distribution to a progress attracting pressure distribution between a time point when the pressurization by the pushing member is begun and a contact end point at which an entire bonding surface of the first substrate and an entire bonding surface of the second substrate come into contact with each other. The progress attracting pressure distribution is created by changing at least one attracting pressure of attracting pressures on the multiple regions in the beginning attracting pressure distribution.
