18457522. Seals for Optical Components simplified abstract (Apple Inc.)
Contents
- 1 Seals for Optical Components
Seals for Optical Components
Organization Name
Inventor(s)
Wei Lin of Santa Clara CA (US)
Nathan K Gupta of Hillsborough CA (US)
Seals for Optical Components - A simplified explanation of the abstract
This abstract first appeared for US patent application 18457522 titled 'Seals for Optical Components
Simplified Explanation
The patent application describes an electronic device with optical components that have glass layers and a polymer layer between them, protected by a hermetic seal with metal layers.
- Optical components in electronic devices have glass layers with a polymer layer between them.
- A hermetic seal with metal layers protects the polymer material of the polymer layer.
- Metal layers are coupled to glass prism rings and bonded through soldering.
Potential Applications
The technology could be used in various electronic devices such as cameras, sensors, and displays that require precise optical components.
Problems Solved
The hermetic seal protects the delicate polymer layer from environmental factors such as moisture, dust, and other contaminants, ensuring the longevity and performance of the optical components.
Benefits
- Enhanced durability and longevity of optical components - Improved performance and reliability of electronic devices - Protection against environmental factors for sensitive components
Potential Commercial Applications
The technology could be valuable in industries such as consumer electronics, automotive, aerospace, and medical devices where high-quality optical components are essential for product functionality and performance.
Possible Prior Art
Prior art may include similar methods of protecting optical components in electronic devices using hermetic seals with metal layers, but the specific combination of glass layers, polymer layer, and metal layers as described in this patent application may be unique.
Unanswered Questions
How does the technology impact the overall cost of manufacturing electronic devices?
The cost implications of implementing this technology in mass production are not addressed in the patent application. It would be interesting to know if the benefits outweigh the additional costs.
Are there any potential limitations or drawbacks to using this technology in certain applications?
The patent application does not discuss any limitations or drawbacks of the technology. It would be important to understand if there are any specific conditions or scenarios where this technology may not be as effective or suitable.
Original Abstract Submitted
An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more metal layers that are coupled to the first and second glass layers. For example, glass prism rings may be coupled to the first and second glass layers and metal may be coupled to the prism rings. The one or more metal layers may then be bonded to the metal on the prism rings, such as through soldering.
