18456865. INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18456865 titled 'INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The abstract describes an integrated circuit device with two semiconductor chips connected by signal through silicon vias (TSVs) and signal bumps on an interposer, reducing the size of the device.
- The integrated circuit device includes a first semiconductor chip with signal TSVs, a second semiconductor chip with signal bumps, and an interposer connecting the two chips.
- The signal TSVs in the first semiconductor chip have a smaller pitch compared to the signal bumps on the lower surface of the second semiconductor chip.
- The interposer electrically connects the signal TSVs with the signal bumps, reducing the area occupied by the TSVs and overall size of the device.
Potential Applications
This technology can be applied in various electronic devices such as smartphones, tablets, and computers to improve performance and reduce size.
Problems Solved
This technology solves the problem of limited space in integrated circuit devices by reducing the area occupied by signal TSVs, allowing for smaller and more efficient devices.
Benefits
The integrated circuit device with this technology offers a smaller size, improved performance, and enhanced connectivity between semiconductor chips.
Potential Commercial Applications
The technology can be utilized in the consumer electronics industry for developing compact and high-performance devices, catering to the demand for smaller and more efficient products.
Possible Prior Art
One possible prior art could be the use of interposers in integrated circuit devices to improve connectivity and reduce size, but the specific implementation of signal TSVs and bumps as described in this patent application may be novel.
Unanswered Questions
How does this technology impact power consumption in integrated circuit devices?
The article does not provide information on the potential effects of this technology on power consumption in electronic devices.
Are there any limitations to the size reduction achieved by this technology?
The article does not address any potential limitations or constraints in further reducing the size of integrated circuit devices using this technology.
Original Abstract Submitted
An integrated circuit device including a first semiconductor chip, a plurality of signal through silicon vias (TSV), a second semiconductor chip, a plurality of signal bumps and an interposer may be provided. The signal TSVs may be in the first semiconductor chip by a first pitch. The second semiconductor chip may be on the first semiconductor chip. The signal bumps may be on a lower surface of the second semiconductor chip by a second pitch wider than the first pitch. The interposer may be interposed between the first semiconductor chip and the second semiconductor chip and may be electrically connecting the signal TSVs with the signal bumps. Thus, an occupying area of the signal TSVs in the first semiconductor chip may be decreased so that the integrated circuit device may have a smaller size.
