18455943. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyungchul Shin of Suwon-si (KR)
Gwangjae Jeon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18455943 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor chip with a first pad on a first substrate, and a first insulating layer surrounding the first pad. It also includes a second semiconductor chip with a second pad below a second substrate, contacting the first pad, and a second insulating layer surrounding the second pad and contacting the first insulating layer. The first pad has an inclined side surface with two side surfaces inclined at obtuse angles with respect to the second surface.
- First semiconductor chip with first pad and first insulating layer
- Second semiconductor chip with second pad and second insulating layer
- Inclined side surface of first pad with two side surfaces at obtuse angles
Potential Applications
The technology described in the patent application could be applied in the following areas:
- Semiconductor packaging
- Integrated circuits
- Electronic devices
Problems Solved
This technology helps to address the following issues:
- Improved contact between semiconductor chips
- Enhanced insulation and protection of pads
- Efficient space utilization in semiconductor packages
Benefits
The benefits of this technology include:
- Enhanced performance of semiconductor devices
- Increased reliability and durability
- Compact and efficient design of semiconductor packages
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications
- Automotive industry
Possible Prior Art
One possible prior art for this technology could be the use of insulating layers in semiconductor packaging to protect pads and improve contact between chips.
Unanswered Questions
How does the inclined side surface of the first pad improve the performance of the semiconductor package?
The inclined side surface of the first pad allows for better contact between the first and second semiconductor chips, potentially leading to improved electrical connectivity and overall performance of the package.
What specific materials are used in the construction of the first and second insulating layers?
The abstract does not provide details on the specific materials used in the insulating layers, which could be crucial for understanding the thermal and electrical properties of the semiconductor package.
Original Abstract Submitted
A semiconductor package includes: a first semiconductor chip including a first pad on a first substrate, and a first insulating layer at least partially surrounding the first pad; and a second semiconductor chip including a second pad below a second substrate and contacting the first pad, and a second insulating layer at least partially surrounding the second pad and contacting the first insulating layer. The first pad includes a first surface contacting the second pad and a second surface opposite the first surface, and an inclined side surface between the first surface and the second surface. The inclined side surface includes a first side surface and a second side surface, facing each other and inclined at a first obtuse angle and a second obtuse angle with respect to the second surface, respectively. Each of the first and second obtuse angles is about 100° to about 130°.
