18453991. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 POWER SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing power semiconductor devices in terms of efficiency and reliability?
- 1.11 What are the specific manufacturing processes involved in creating this power semiconductor device?
- 1.12 Original Abstract Submitted
POWER SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Keitaro Ichikawa of Tokyo (JP)
POWER SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18453991 titled 'POWER SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a power semiconductor device with a unique structure involving multiple mold packages and terminals arranged in a staggered pattern.
- The power semiconductor device includes a conductor plate, insulator, lead frame, first mold package with semiconductor elements, and a second mold package.
- The lead frame has terminals protruding from one side of the first mold package, projecting from the front surface of the second mold package in a staggered pattern.
- The terminals are alternately arranged closer to one side of the front surface in plan view.
Potential Applications
This technology could be applied in various power electronics devices, such as inverters, converters, and motor drives.
Problems Solved
This design helps improve the thermal performance and reliability of power semiconductor devices by providing efficient heat dissipation and protection from external elements.
Benefits
The staggered terminal arrangement allows for better electrical connections and space utilization within the device, enhancing overall performance and compactness.
Potential Commercial Applications
This technology could be valuable in industries like automotive, renewable energy, industrial automation, and consumer electronics for efficient power management solutions.
Possible Prior Art
Prior art may include similar power semiconductor devices with multiple mold packages and terminal arrangements, but the specific staggered pattern design may be unique to this patent application.
Unanswered Questions
How does this technology compare to existing power semiconductor devices in terms of efficiency and reliability?
The article does not provide a direct comparison with existing power semiconductor devices in terms of efficiency and reliability.
What are the specific manufacturing processes involved in creating this power semiconductor device?
The article does not delve into the specific manufacturing processes involved in creating this power semiconductor device.
Original Abstract Submitted
A power semiconductor device according to the present disclosure includes, in the following order, a conductor plate, an insulator, a lead frame, a first mold package including a plurality of semiconductor elements provided on the lead frame inside thereof, and resin-sealed such that a main surface of the conductor plate opposite to a side on which the insulator is provided is exposed, and a second mold package in which the first mold package is resin-sealed such that the main surface is exposed, in which the lead frame has a plurality of terminals protruding from one side surface of the first mold package, the plurality of terminals are projecting from a front surface of the second mold package opposite to the conductor plate, and the plurality of terminals are alternately arranged to form a staggered pattern closer to one side of the front surface in plan view.
