18451819. SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Kazuhiro Kawahara of Tokyo (JP)
Kosuke Yamaguchi of Tokyo (JP)
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18451819 titled 'SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
Simplified Explanation
The object of this technology is to shorten the routing length of a gate wire connecting a control IC to first and second semiconductor elements connected in parallel with each other.
- First semiconductor element and second semiconductor element are placed facing each other, with a control IC, first semiconductor element, and second semiconductor element arranged in a specific order.
- The gate pad is located on one side of the first semiconductor element in a specific direction, and on the other side of the second semiconductor element in the same direction.
Potential Applications
This technology could be applied in the manufacturing of electronic devices such as integrated circuits, power modules, and semiconductor devices.
Problems Solved
This technology solves the issue of long routing lengths for gate wires connecting control ICs to semiconductor elements, improving efficiency and reducing signal delays.
Benefits
The benefits of this technology include improved performance, reduced signal delays, and increased efficiency in electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry, power electronics industry, and integrated circuit manufacturing.
Possible Prior Art
One possible prior art for this technology could be the use of flip-chip technology in semiconductor devices to reduce signal delays and improve performance.
Unanswered Questions
How does this technology compare to existing methods of shortening routing lengths in electronic devices?
This article does not provide a direct comparison to existing methods of shortening routing lengths in electronic devices.
What specific electronic devices could benefit the most from this technology?
This article does not specify which electronic devices could benefit the most from this technology.
Original Abstract Submitted
The object is to provide a technology that can shorten a routing length of a gate wire connecting a control IC that controls driving first and second semiconductor elements that are connected in parallel with each other, to a gate pad of one of the first and second semiconductor elements disposed distant from the control IC. A first semiconductor element and a second semiconductor element are disposed so that a long side of the first semiconductor element faces a side of the second semiconductor element, and a HVIC or a LVIC, the first semiconductor element, and the second semiconductor element are disposed in this order in a direction orthogonal to a first direction, the gate pad is disposed on the first semiconductor element on one side in the first direction, and the gate pad is disposed on the second semiconductor element on the other side in the first direction.
