18403763. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chung-Jung Wu of Hsinchu City (TW)

Chih-Hang Tung of Hsinchu (TW)

Tung-Liang Shao of Hsinchu (TW)

Sheng-Tsung Hsiao of Taoyuan City (TW)

Jen-Yu Wang of Hsinchu City (TW)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18403763 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor device described in the patent application includes a package with a cooling cover. The package contains a first die with micro-trenches in the cooling region of the rear surface, while the cooling cover has fluid inlet and outlet ports connected to the micro-trenches.

• The package includes a first die with micro-trenches in the cooling region of the rear surface.
• The cooling cover is stacked on the first die and has fluid inlet and outlet ports connected to the micro-trenches.

Potential Applications

The technology could be applied in:

• High-performance computing systems
• Data centers
• Automotive electronics

Problems Solved

The technology addresses issues such as:

• Heat dissipation in semiconductor devices
• Thermal management in electronic systems

Benefits

The benefits of this technology include:

• Improved cooling efficiency
• Enhanced performance and reliability of semiconductor devices
• Extended lifespan of electronic components

Potential Commercial Applications

The technology could be commercially applied in:

• Semiconductor manufacturing industry
• Electronics cooling systems market
• Thermal management solutions sector

Possible Prior Art

One possible prior art could be:

• Heat sink designs for cooling electronic components

Unanswered Questions

How does the size of the micro-trenches impact cooling efficiency?

The article does not provide specific details on the optimal size of the micro-trenches for cooling effectiveness.

Are there any limitations to the type of fluids that can be used in the cooling cover?

The article does not mention any restrictions on the type of fluids that can be utilized in the cooling cover for the semiconductor device.

Original Abstract Submitted

A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.