18403044. INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Shao-Kuan Lee of Kaohsiung City (TW)
Hai-Ching Chen of Hsinchu City (TW)
Hsin-Yen Huang of New Taipei City (TW)
Cheng-Chin Lee of Taipei City (TW)
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP - A simplified explanation of the abstract
This abstract first appeared for US patent application 18403044 titled 'INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
Simplified Explanation
The present disclosure describes an integrated chip with various components arranged in a specific configuration for improved performance and functionality.
- The integrated chip includes a first metal line on a substrate, a via directly over the first metal line, a first dielectric structure laterally adjacent to the first metal line, and a first protective etch-stop structure over the first dielectric structure.
- The via has a first lower surface and a second lower surface, with the first protective etch-stop structure separating the second lower surface from the top of the first dielectric structure.
- The arrangement of these components helps in optimizing the electrical connections and signal transmission within the integrated chip.
Potential Applications
This technology can be applied in:
- Semiconductor manufacturing
- Integrated circuit design
- Electronic devices
Problems Solved
This technology helps in:
- Improving signal transmission efficiency
- Enhancing the overall performance of integrated chips
Benefits
The benefits of this technology include:
- Increased reliability of integrated chips
- Enhanced functionality and speed of electronic devices
Potential Commercial Applications
This technology can be used in:
- Consumer electronics
- Telecommunications industry
- Automotive sector
Possible Prior Art
One possible prior art for this technology could be the use of protective etch-stop structures in semiconductor manufacturing processes to improve the performance of integrated chips.
Unanswered Questions
1. How does the integration of the protective etch-stop structure impact the overall size and cost of manufacturing integrated chips? 2. Are there any limitations or drawbacks associated with the specific configuration of components described in the integrated chip?
Original Abstract Submitted
In some embodiments, the present disclosure relates to an integrated chip. The integrated chip may comprise a first metal line disposed over a substrate. A via may be disposed directly over a top of the first metal line and the via may comprise a first lower surface and a second lower surface above the first lower surface. A first dielectric structure may be disposed laterally adjacent to the first metal line and may be disposed along a sidewall of the first metal line. A first protective etch-stop structure may be disposed directly over a top of the first dielectric structure and the first protective etch-stop structure may vertically separate the second lower surface of the via from the top of the first dielectric structure.
