18402734. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yu-Chien Ku of Tainan City (TW)
Huai-Jen Tung of Tainan City (TW)
Keng-Ying Liao of Tainan City (TW)
Yi-Hung Chen of Kaohsiung (TW)
Shih-Hsun Hsu of New Taipei City (TW)
Yi-Fang Yang of Tainan City (TW)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18402734 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract consists of a single-layered dielectric layer, a conductive line, a conductive via, and a conductive pad. The conductive line and conductive via are both located within the single-layered dielectric layer, while the conductive pad extends into the dielectric layer to establish electrical connection with the conductive line.
- The semiconductor device includes a single-layered dielectric layer.
- A conductive line and a conductive via are positioned within the single-layered dielectric layer.
- A conductive pad extends into the single-layered dielectric layer to connect with the conductive line.
Potential Applications
The technology described in this patent application could be applied in various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.
Problems Solved
This technology solves the problem of efficiently connecting different components within a semiconductor device while minimizing signal loss and interference.
Benefits
The benefits of this technology include improved performance, reduced power consumption, and increased reliability of semiconductor devices.
Potential Commercial Applications
One potential commercial application of this technology is in the manufacturing of advanced electronic devices for consumer electronics, telecommunications, and automotive industries.
Possible Prior Art
One possible prior art for this technology could be the use of multi-layered dielectric layers in semiconductor devices to achieve similar electrical connections.
Unanswered Questions
How does this technology compare to existing methods of connecting components in semiconductor devices?
This article does not provide a direct comparison between this technology and existing methods, leaving the reader to wonder about the advantages and disadvantages of this innovation.
What are the specific manufacturing processes involved in implementing this technology?
The article does not delve into the specific manufacturing processes required to incorporate this technology into semiconductor devices, leaving a gap in understanding for readers interested in the practical aspects of its implementation.
Original Abstract Submitted
A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.
