18401928. SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chun-Chih Chuang of Taichung (TW)
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18401928 titled 'SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
Simplified Explanation
The patent application describes a package with an interposer structure that does not contain any active devices. The interposer structure includes an interconnect device, a dielectric film surrounding the interconnect device, and a first metallization pattern bonded to the interconnect device. Additionally, the package includes a first device die bonded to the opposing side of the first metallization pattern as the interconnect device, and a second device die bonded to the same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.
- Interposer structure with interconnect device, dielectric film, and metallization pattern
- First device die bonded to one side of the metallization pattern
- Second device die bonded to the same side of the metallization pattern as the first device die
- Interconnect device electrically connects the first device die to the second device die
Potential Applications
The technology described in the patent application could be used in:
- High-performance computing systems
- Data centers
- Telecommunications equipment
Problems Solved
This technology helps in:
- Improving electrical connections between device dies
- Enhancing overall package reliability
- Reducing signal interference
Benefits
The benefits of this technology include:
- Increased performance of electronic devices
- Enhanced signal transmission efficiency
- Improved thermal management
Potential Commercial Applications
The technology could be applied in:
- Semiconductor manufacturing industry
- Electronics packaging companies
- Telecommunication equipment manufacturers
Possible Prior Art
One possible prior art for this technology could be:
- Existing interposer structures with active devices
- Traditional packaging methods for electronic components
Unanswered Questions
How does this technology compare to existing interposer structures with active devices?
The patent application does not provide a direct comparison between this technology and existing interposer structures with active devices. Further research or analysis would be needed to determine the specific advantages and disadvantages of this innovation compared to the traditional methods.
What are the specific challenges in implementing this technology in mass production?
The patent application does not address the potential challenges in implementing this technology in mass production. Factors such as cost, scalability, and compatibility with existing manufacturing processes could pose challenges that need to be explored further.
Original Abstract Submitted
A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.
