18401811. PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
An-Jhih Su of Taoyuan City (TW)
Wei-Yu Chen of New Taipei City (TW)
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18401811 titled 'PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
Simplified Explanation
The method described in the patent application involves the integration of an electronic die and a photonic die on a carrier, with subsequent encapsulation, planarization, and formation of redistribution lines to electrically connect the two dies. An optical coupler is attached to the photonic die, allowing for optical coupling with an optical fiber.
- Integration of electronic die and photonic die on a carrier
- Encapsulation and planarization of the dies
- Formation of redistribution lines to connect the electronic and photonic dies
- Attachment of an optical coupler to the photonic die
- Optical coupling with an optical fiber
Potential Applications
The technology described in the patent application could have potential applications in:
- Telecommunications
- Data centers
- Optical networking
Problems Solved
This technology helps in:
- Integrating electronic and photonic components
- Improving optical communication efficiency
- Enhancing data transfer speeds
Benefits
The benefits of this technology include:
- Increased data transfer rates
- Enhanced optical communication capabilities
- Compact and integrated electronic-photonic systems
Potential Commercial Applications
The technology could find commercial applications in:
- Telecommunication equipment manufacturing
- Data center infrastructure development
- Optical networking solutions
Possible Prior Art
One possible prior art for this technology could be the integration of electronic and photonic components in semiconductor devices for optical communication purposes.
Unanswered Questions
How does the technology impact the overall cost of manufacturing electronic-photonic integrated systems?
The patent application does not provide information on the cost implications of implementing this technology in manufacturing processes.
What are the specific performance metrics that can be achieved with this integrated electronic-photonic system?
The patent application does not detail the specific performance metrics or benchmarks that can be achieved with the described technology.
Original Abstract Submitted
A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.
