18400347. ELECTRONIC APPARATUS simplified abstract (Samsung Display Co., LTD.)
Contents
- 1 ELECTRONIC APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing methods of connecting circuit boards and electronic panels?
- 1.11 What are the specific industries or sectors that could benefit most from this technology?
- 1.12 Original Abstract Submitted
ELECTRONIC APPARATUS
Organization Name
Inventor(s)
JUNHO Kwack of Geumsan-gun (KR)
DONGJIN Park of Seongnam-si (KR)
DONG-YOUB Lee of Cheonan-si (KR)
ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18400347 titled 'ELECTRONIC APPARATUS
Simplified Explanation
The electronic apparatus described in the patent application includes an electronic panel with pads, a circuit board with leads, and a conductive adhesive member to connect the two. The pads consist of pixel pads, an arrangement pad, and a resistance measurement pad. The leads include pixel leads, an arrangement lead, and a resistance measurement lead. The resistance measurement lead is connected to the resistance measurement pad and includes resistance measurement leads and a dummy lead.
- Electronic apparatus with electronic panel, circuit board, and conductive adhesive member
- Panel includes pixel pads, arrangement pad, and resistance measurement pad
- Leads include pixel leads, arrangement lead, and resistance measurement lead
- Resistance measurement lead connected to resistance measurement pad
- Includes resistance measurement leads and dummy lead
Potential Applications
The technology described in this patent application could be applied in various electronic devices that require precise electrical connections between circuit boards and electronic panels.
Problems Solved
This technology solves the problem of ensuring accurate and reliable electrical connections between circuit boards and electronic panels in electronic devices.
Benefits
The benefits of this technology include improved electrical connectivity, enhanced device performance, and increased reliability in electronic devices.
Potential Commercial Applications
One potential commercial application of this technology could be in the manufacturing of smartphones, tablets, or other electronic devices where precise electrical connections are crucial for optimal performance.
Possible Prior Art
One possible prior art for this technology could be similar patents or innovations related to improving electrical connections in electronic devices.
Unanswered Questions
How does this technology compare to existing methods of connecting circuit boards and electronic panels?
This article does not provide a direct comparison to existing methods, leaving the reader to wonder about the advantages and disadvantages of this new technology.
What are the specific industries or sectors that could benefit most from this technology?
The article does not specify which industries or sectors could benefit the most from this technology, leaving the reader to speculate on potential applications.
Original Abstract Submitted
An electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. The plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. The plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads. The resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.
