18397915. HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS simplified abstract (Intel Corporation)

HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS

Organization Name

Intel Corporation

Inventor(s)

Debendra Mallik of Chandler AZ (US)

Ravindranath Mahajan of Chandler AZ (US)

Robert Sankman of Phoenix AZ (US)

Shawna Liff of Scottsdale AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Bharat Penmecha of Phoenix AZ (US)

HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18397915 titled 'HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS

Simplified Explanation

The abstract of the patent application describes electronic packages with nested components and interconnects. Here is a simplified explanation of the abstract:

• Electronic packages with interposers and nested components are disclosed.
• The package includes a cavity passing through the interposer for the nested component.
• A die is coupled to the interposer by a first interconnect and to the nested component by a second interconnect.
• The interconnects consist of a first bump, a bump pad over the first bump, and a second bump over the bump pad.

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1. 1. 1. Potential Applications of this Technology

• Advanced electronic devices
• High-performance computing systems
• Aerospace and defense systems

1. 1. 1. Problems Solved by this Technology

• Efficient integration of components
• Improved thermal management
• Enhanced electrical performance

1. 1. 1. Benefits of this Technology

• Higher component density
• Enhanced reliability
• Improved signal integrity

1. 1. 1. Potential Commercial Applications of this Technology
         1. Optimizing Electronic Package Design for Improved Performance

1. 1. 1. Possible Prior Art

No prior art is known at this time.

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1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does this technology impact the overall cost of electronic packages?

The abstract does not provide information on the cost implications of implementing this technology. Further research or analysis would be needed to determine the cost-effectiveness of these electronic packages.

1. 1. 1. 1. What are the environmental implications of using electronic packages with nested components?

The abstract does not address the environmental impact of this technology. Additional studies would be required to assess the sustainability of electronic packages with nested components.

Original Abstract Submitted

Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.