18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD
Organization Name
Inventor(s)
Gianni Signorini of Garching bei Muenchen (DE)
Georg Seidemann of Landshut (DE)
Bernd Waidhas of Pettendorf (DE)
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18397898 titled 'METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD
Simplified Explanation
The abstract describes electronic packages with conformal shields and methods of forming such packages. The package includes a die with a redistribution layer and a conductive shield over the sidewall surfaces and second surface of the die.
- Explanation:
- Electronic packages with conformal shields - Die with redistribution layer and conductive shield - Shield electrically coupled to the UBM layer
- Potential Applications:
- Aerospace and defense industries - Automotive electronics - Consumer electronics
- Problems Solved:
- Electromagnetic interference - Signal integrity issues - Protection of sensitive electronic components
- Benefits:
- Improved performance and reliability - Enhanced signal transmission - Increased lifespan of electronic devices
- Potential Commercial Applications:
- Semiconductor manufacturing companies - Electronics packaging companies - Technology research and development firms
- Possible Prior Art:
- Previous methods of shielding electronic packages - Traditional die packaging techniques
Questions:
1. How does the conductive shield improve the performance of the electronic package? 2. Are there any specific industries that would benefit the most from this technology?
- Question 1:
The conductive shield helps to reduce electromagnetic interference and improve signal integrity within the electronic package, leading to enhanced overall performance.
- Question 2:
Industries such as aerospace, defense, and automotive electronics, which require high reliability and signal transmission quality, would benefit the most from this technology.
Original Abstract Submitted
Embodiments disclosed herein include electronic packages with conformal shields and methods of forming such packages. In an embodiment, the electronic package comprises a die having a first surface, a second surface opposite the first surface, and sidewall surfaces. A redistribution layer is over the first surface of the die, and the redistribution layer comprises a first conductive layer. In an embodiment, an under ball metallization (UBM) layer is over the redistribution layer, and a conductive shield is over the sidewall surfaces of the die and the second surface of the die. In an embodiment, the conductive shield is electrically coupled to the UBM layer.
