View source for 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)

=METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Gianni Signorini of Garching bei Muenchen (DE)|Gianni Signorini of Garching bei Muenchen (DE)]][[Category:Gianni Signorini of Garching bei Muenchen (DE)]]

[[:Category:Georg Seidemann of Landshut (DE)|Georg Seidemann of Landshut (DE)]][[Category:Georg Seidemann of Landshut (DE)]]

[[:Category:Bernd Waidhas of Pettendorf (DE)|Bernd Waidhas of Pettendorf (DE)]][[Category:Bernd Waidhas of Pettendorf (DE)]]

==METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18397898 titled 'METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD

==Simplified Explanation==

The abstract describes electronic packages with conformal shields and methods of forming such packages. The package includes a die with a redistribution layer and a conductive shield over the sidewall surfaces and second surface of the die.

* Explanation:
- Electronic packages with conformal shields
- Die with redistribution layer and conductive shield
- Shield electrically coupled to the UBM layer

** Potential Applications:
- Aerospace and defense industries
- Automotive electronics
- Consumer electronics

** Problems Solved:
- Electromagnetic interference
- Signal integrity issues
- Protection of sensitive electronic components

** Benefits:
- Improved performance and reliability
- Enhanced signal transmission
- Increased lifespan of electronic devices

** Potential Commercial Applications:
- Semiconductor manufacturing companies
- Electronics packaging companies
- Technology research and development firms

** Possible Prior Art:
- Previous methods of shielding electronic packages
- Traditional die packaging techniques

Questions:

1. How does the conductive shield improve the performance of the electronic package?
2. Are there any specific industries that would benefit the most from this technology? 

** Question 1: 
The conductive shield helps to reduce electromagnetic interference and improve signal integrity within the electronic package, leading to enhanced overall performance.

** Question 2:
Industries such as aerospace, defense, and automotive electronics, which require high reliability and signal transmission quality, would benefit the most from this technology.


==Original Abstract Submitted==

Embodiments disclosed herein include electronic packages with conformal shields and methods of forming such packages. In an embodiment, the electronic package comprises a die having a first surface, a second surface opposite the first surface, and sidewall surfaces. A redistribution layer is over the first surface of the die, and the redistribution layer comprises a first conductive layer. In an embodiment, an under ball metallization (UBM) layer is over the redistribution layer, and a conductive shield is over the sidewall surfaces of the die and the second surface of the die. In an embodiment, the conductive shield is electrically coupled to the UBM layer.



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