18396174. INTEGRATED CIRCUIT CONTACT STRUCTURES simplified abstract (Intel Corporation)
Contents
- 1 INTEGRATED CIRCUIT CONTACT STRUCTURES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT CONTACT STRUCTURES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED CIRCUIT CONTACT STRUCTURES
Organization Name
Inventor(s)
Patrick Morrow of Portland OR (US)
Glenn A. Glass of Portland OR (US)
Anand S. Murthy of Portland OR (US)
Rishabh Mehandru of Portland OR (US)
INTEGRATED CIRCUIT CONTACT STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18396174 titled 'INTEGRATED CIRCUIT CONTACT STRUCTURES
Simplified Explanation
The abstract describes an integrated circuit (IC) contact structure with an electrical element, a metal layer, and a semiconductor material.
- The IC contact structure includes an electrical element, a metal layer, and a semiconductor material.
- The metal layer conductively couples the semiconductor material and the electrical element.
Potential Applications
The technology could be applied in:
- Semiconductor manufacturing
- Electronics industry
Problems Solved
This technology helps in:
- Improving conductivity in IC contact structures
- Enhancing performance of integrated circuits
Benefits
The benefits of this technology include:
- Increased efficiency in electronic devices
- Better overall performance of integrated circuits
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Semiconductor companies
- Electronics manufacturers
Possible Prior Art
One possible prior art could be:
- Existing IC contact structures with different configurations
Unanswered Questions
How does this technology impact the cost of manufacturing integrated circuits?
The article does not provide information on the cost implications of implementing this technology in IC manufacturing processes.
Are there any limitations to the size or scale at which this technology can be implemented?
The article does not address any potential limitations related to the size or scale of IC contact structures using this technology.
Original Abstract Submitted
Disclosed herein are integrated circuit (IC) contact structures, and related devices and methods. For example, in some embodiments, an IC contact structure may include an electrical element, a metal on the electrical element, and a semiconductor material on the metal. The metal may conductively couple the semiconductor material and the electrical element.
