18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS

Organization Name

Intel Corporation

Inventor(s)

Debendra Mallik of Chandler AZ (US)

Je-Young Chang of Tempe AZ (US)

Ram Viswanath of Phoenix AZ (US)

Elah Bozorg-grayeli of Chandler AZ (US)

Ahmad Al Mohammad of Portland OR (US)

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18395351 titled 'IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS

Simplified Explanation

The patent application describes a method of assembling thermal heat spreaders and IC die with solderable thermal structures using a solder array thermal interconnect.

• Thermal heat spreaders and IC die are assembled together with solderable thermal structures.
• The thermal heat spreader may include a non-metallic material with metallized surfaces for bonding to a solder alloy.
• The IC die may have a metallized back-side surface suitable for bonding to a solder alloy thermal interconnect.
• Metallization on the IC die and heat spreader may consist of solderable structures.
• A multi-chip package can accommodate multiple IC die with different thicknesses using z-height thickness variation in the thermal interconnects and solderable structures.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as computers, smartphones, and other gadgets that require efficient thermal management.

Problems Solved

This innovation solves the problem of heat dissipation in electronic devices, ensuring that the IC die and heat spreaders remain at optimal operating temperatures.

Benefits

The benefits of this technology include improved thermal performance, increased reliability of electronic devices, and potentially longer lifespan of the components.

Potential Commercial Applications

This technology could be valuable in the semiconductor industry, electronics manufacturing, and any other field where thermal management is critical for device performance.

Possible Prior Art

One possible prior art could be the use of thermal interface materials in electronic devices to improve heat dissipation and thermal conductivity.

How does this technology compare to traditional heat dissipation methods in electronic devices?

This technology offers a more efficient and reliable solution for managing heat in electronic devices compared to traditional methods like thermal paste or pads.

What impact could this technology have on the design of future electronic devices?

This technology could lead to more compact and powerful electronic devices by enabling better thermal management and potentially allowing for higher performance components to be used.

Original Abstract Submitted

Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.