18383072. EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND
Organization Name
Inventor(s)
Songwon Hyun of Yongin-si (KR)
Mijeong Kim of Hwaseong-si (KR)
Sangsoo Jee of Hwaseong-si (KR)
EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND - A simplified explanation of the abstract
This abstract first appeared for US patent application 18383072 titled 'EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING EPOXY COMPOUND
Simplified Explanation
The patent application describes an epoxy compound with an aromatic ring represented by Formula 1 or Formula 2, along with compositions, semiconductor devices, electronic devices, articles, and methods prepared from the epoxy compound.
- The epoxy compound contains an aromatic ring, which can enhance the properties of the compound.
- The composition prepared from the epoxy compound can be used in various applications due to its unique properties.
- Semiconductor devices prepared from the epoxy compound may exhibit improved performance and reliability.
- Electronic devices made from the epoxy compound could benefit from its specific characteristics.
- Articles prepared from the epoxy compound may have enhanced durability and functionality.
Potential Applications
The epoxy compound and its derivatives could be used in:
- Adhesives and sealants
- Coatings and paints
- Electronic packaging materials
- Printed circuit boards
- Composite materials
Problems Solved
The epoxy compound addresses issues such as:
- Improving the performance of semiconductor devices
- Enhancing the properties of electronic devices
- Increasing the durability of articles made from the compound
- Providing a versatile material for various applications
Benefits
The technology offers benefits such as:
- Enhanced properties due to the aromatic ring structure
- Improved performance and reliability in semiconductor devices
- Versatile applications in different industries
- Potential for creating high-quality electronic and composite materials
Original Abstract Submitted
An epoxy compound having an aromatic ring represented by Formula 1 or Formula 2, a composition prepared from the epoxy compound, a semiconductor device prepared from the epoxy compound, an electronic device prepared from the epoxy compound, an article prepared from the epoxy compound, and a method of preparing the epoxy compound:
