View source for 18381061. INTERPOSERS FOR MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)

=INTERPOSERS FOR MICROELECTRONIC DEVICES=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Owen Fay of Meridian ID (US)|Owen Fay of Meridian ID (US)]][[Category:Owen Fay of Meridian ID (US)]]

[[:Category:Chan H. Yoo of Boise ID (US)|Chan H. Yoo of Boise ID (US)]][[Category:Chan H. Yoo of Boise ID (US)]]

==INTERPOSERS FOR MICROELECTRONIC DEVICES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18381061 titled 'INTERPOSERS FOR MICROELECTRONIC DEVICES

==Simplified Explanation==

The semiconductor interposer described in the patent application includes multiple redistribution structures on each side of the core, with each structure having multiple individual redistribution layers. The interposer may also include circuit elements, such as passive and/or active circuits, which can be formed partially within the semiconductor core.

* The semiconductor interposer has multiple redistribution structures on each side of the core.
* Each redistribution structure has multiple individual redistribution layers.
* The interposer may include circuit elements like passive and/or active circuits.
* The circuit elements can be formed partially within the semiconductor core.

== Potential Applications ==
The technology described in the patent application could be applied in:
* High-performance computing systems
* Advanced communication devices
* Automotive electronics

== Problems Solved ==
The technology addresses the following issues:
* Enhanced signal transmission efficiency
* Improved thermal management
* Increased integration density

== Benefits ==
The benefits of this technology include:
* Higher performance capabilities
* Greater design flexibility
* Enhanced reliability and durability

== Potential Commercial Applications ==
The technology could be commercially applied in:
* Data centers
* Telecommunications infrastructure
* Automotive industry

== Possible Prior Art ==
One possible prior art for this technology could be the use of traditional interposer structures with fewer redistribution layers and circuit elements.

== Unanswered Questions ==
=== How does the technology impact overall system cost? ===
The article does not provide information on the cost implications of implementing this technology. Further research is needed to understand its impact on overall system cost.

=== What are the environmental implications of using this technology? ===
The article does not discuss the environmental aspects of the technology. Future studies could explore the environmental footprint of incorporating this innovation in electronic devices.


==Original Abstract Submitted==

Described are semiconductor interposer, and microelectronic device assemblies incorporating such semiconductor interposers. The described interposers include multiple redistribution structures on each side of the core; each of which may include multiple individual redistribution layers. The interposers may optionally include circuit elements, such as passive and/or active circuit. The circuit elements may be formed at least partially within the semiconductor core.



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