18380424. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Choongbin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380424 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a redistribution substrate with redistribution layers, a semiconductor chip connected to the redistribution layers, an upper encapsulant covering the semiconductor chip, a passive component connected to the redistribution layer on the lower surface of the substrate, a lower encapsulant covering the passive component and exposing lowermost redistribution layers, and bumps within the openings in the lower encapsulant.
- The semiconductor package includes a redistribution substrate with redistribution layers.
- A semiconductor chip is connected to the redistribution layers on the upper surface of the substrate.
- An upper encapsulant covers at least a portion of the semiconductor chip.
- A passive component is connected to the redistribution layer on the lower surface of the substrate.
- A lower encapsulant covers at least a portion of the passive component and exposes lowermost redistribution layers.
- Bumps are disposed within the openings in the lower encapsulant, with a first portion in contact with the lowermost redistribution layers and a second portion protruding partially downwardly.
Potential Applications
This technology can be applied in the manufacturing of advanced semiconductor packages for various electronic devices, such as smartphones, tablets, and computers.
Problems Solved
This technology solves the problem of efficiently connecting semiconductor chips and passive components within a semiconductor package while ensuring proper electrical connections and protection.
Benefits
The benefits of this technology include improved performance, reliability, and durability of semiconductor packages, leading to enhanced functionality and longevity of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing companies, and consumer electronics companies.
Possible Prior Art
One possible prior art for this technology could be the use of redistribution substrates and encapsulants in semiconductor packaging processes to improve electrical connections and protect semiconductor components.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness and performance?
This article does not provide a direct comparison between this technology and existing semiconductor packaging methods in terms of cost-effectiveness and performance.
What are the specific materials and manufacturing processes used in creating the semiconductor package described in the abstract?
The article does not delve into the specific materials and manufacturing processes used in creating the semiconductor package described in the abstract.
Original Abstract Submitted
A semiconductor package is provided including: a redistribution substrate having an upper surface and a lower surface, opposite to each other, and including redistribution layers; a semiconductor chip disposed on the upper surface of the redistribution substrate and electrically connected to the redistribution layers; an upper encapsulant encapsulating at least a portion of the semiconductor chip and disposed on the upper surface of the redistribution substrate; a passive component disposed on the lower surface of the redistribution substrate and electrically connected to the redistribution layer; a lower encapsulant encapsulating at least a portion of the passive component and disposed on the lower surface of the redistribution substrate, and having a plurality of openings exposing lowermost redistribution layers among the redistribution layers; and a plurality of bumps respectively disposed within the plurality of openings, the bumps respectively including a first portion in contact with the lowermost redistribution layers and a second portion extending from the first portion and protruding partially downwardly of the plurality of openings.
