18374396. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEOKHYUN Lee of Hwaseong-si (KR)
KYOUNG LIM Suk of Suwon-si (KR)
JAEGWON Jang of Hwaseong-si (KR)
GWANGJAE Jeon of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18374396 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract of this patent application describes a semiconductor package that consists of a redistribution substrate, a connection terminal, and a semiconductor chip stacked in sequence. The redistribution substrate includes an insulating layer with multiple vertically stacked redistribution patterns, each having interconnection and via portions. The topmost redistribution pattern has a bonding pad on its interconnection portion, which may be made of a different metallic material than the pattern itself. The bonding pad has two surfaces, with the first surface in contact with the top surface of the interconnection portion and a portion of the second surface in contact with the connection terminal. The insulating layer extends to be in contact with the remaining portion of the second surface.
- The semiconductor package includes a redistribution substrate, connection terminal, and semiconductor chip stacked together.
- The redistribution substrate has multiple vertically stacked redistribution patterns with interconnection and via portions.
- The topmost redistribution pattern has a bonding pad on its interconnection portion, made of a different metallic material.
- The bonding pad has two surfaces, with the first surface in contact with the top surface of the interconnection portion.
- A portion of the second surface of the bonding pad is in contact with the connection terminal.
- The insulating layer extends to be in contact with the remaining portion of the second surface.
Potential applications of this technology:
- Semiconductor packaging for various electronic devices, such as smartphones, tablets, and computers.
- Integrated circuits and microprocessors used in electronic devices.
- High-speed data transmission and communication systems.
Problems solved by this technology:
- Improved electrical connectivity and signal transmission within the semiconductor package.
- Enhanced reliability and performance of the semiconductor chip.
- Reduction in size and weight of the semiconductor package.
Benefits of this technology:
- Higher efficiency and functionality of electronic devices.
- Increased data processing speed and performance.
- Improved durability and lifespan of semiconductor packages.
- Cost-effective manufacturing processes.
Original Abstract Submitted
A semiconductor package may include a redistribution substrate, a connection terminal, and a semiconductor chip sequentially stacked. The redistribution substrate may include an insulating layer, a plurality of redistribution patterns, which are vertically stacked in the insulating layer, and each of which includes interconnection and via portions, and a bonding pad on the interconnection portion of the topmost redistribution pattern. The topmost redistribution pattern and the bonding pad may include different metallic materials. The bonding pad may have first and second surfaces opposite to each other. The first surface of the bonding pad may be in contact with a top surface of the interconnection portion of the topmost redistribution pattern. A portion of the second surface of the bonding pad may be in contact with the connection terminal. The insulating layer may be extended to be in contact with the remaining portion of the second surface.
