18372817. ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION simplified abstract (SKYWORKS SOLUTIONS, INC.)
Contents
- 1 ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION
Organization Name
Inventor(s)
Tomoya Komatsu of Irvine CA (US)
Atsushi Takano of Kadoma-Shi (JP)
ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18372817 titled 'ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION
Simplified Explanation
The method described in the abstract involves fabricating an acoustic wave resonator by layering dielectric, electrode, piezoelectric, and conductive materials on a substrate.
- Dielectric layer formed on substrate upper surface
- Lower electrode formed on dielectric layer upper surface
- Piezoelectric material layer formed on lower electrode upper surface
- Dielectric material layer formed in dielectric layer after lower electrode and piezoelectric material
- Conductive through substrate formed passing through substrate, dielectric material layer, and contacting lower electrode lower surface
Potential Applications
The technology could be used in:
- Acoustic wave filters
- Sensors
- Transducers
Problems Solved
This technology helps in:
- Improving acoustic wave resonator performance
- Enhancing sensor sensitivity
- Increasing transducer efficiency
Benefits
The benefits of this technology include:
- Higher quality acoustic wave resonators
- Improved sensor accuracy
- Enhanced transducer functionality
Potential Commercial Applications
This technology could be applied in:
- Telecommunications industry
- Medical devices
- Automotive sector
Possible Prior Art
One possible prior art could be the fabrication of acoustic wave resonators using similar layering techniques.
Unanswered Questions
How does this technology compare to traditional acoustic wave resonator fabrication methods?
This technology offers improved performance and efficiency compared to traditional methods by utilizing advanced materials and processes.
What are the potential cost implications of implementing this technology in mass production?
The cost implications of mass-producing acoustic wave resonators using this method would depend on factors such as material costs, equipment efficiency, and economies of scale.
Original Abstract Submitted
A method of fabricating an acoustic wave resonator includes forming a dielectric layer on an upper surface of a substrate, forming a lower electrode on an upper surface of the dielectric layer, forming a layer of piezoelectric material on an upper surface of the lower electrode, forming a dielectric material layer via in the dielectric layer subsequent to forming the lower electrode and the layer of piezoelectric material, and forming a conductive through substrate via passing through the substrate and the dielectric material layer via and contacting a lower surface of the lower electrode.
