18370283. SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18370283 titled 'SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor device described in the abstract includes a first semiconductor chip with a quadrangle shape from a plan view. It has a first semiconductor substrate with a first surface and a second surface, a first active layer adjacent to the first surface, a first through electrode connected to the first active layer, a second chip connection pad connected to the first through electrode, a first dummy pattern positioned outside the second chip connection pad on the second surface, and a first chip connection pad on the first surface connected to the first through electrode.
- The semiconductor device includes a first semiconductor chip with a quadrangle shape from a plan view.
- The first semiconductor chip has a first through electrode connected to a first active layer.
- A first dummy pattern is positioned outside the second chip connection pad on the second surface of the first semiconductor substrate.
- The first dummy pattern comprises a line pattern extending horizontally along the second surface of the first semiconductor substrate.
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for the development of advanced semiconductor devices with improved connectivity and layout design.
Problems Solved
This technology addresses the need for efficient chip connection and layout optimization in semiconductor devices, particularly those with complex geometries.
Benefits
The benefits of this technology include enhanced performance, increased reliability, and simplified manufacturing processes for semiconductor devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the production of high-performance electronic devices, such as smartphones, tablets, and computers.
Possible Prior Art
One possible prior art for this technology could be the use of dummy patterns in semiconductor devices to improve layout design and connectivity.
Unanswered Questions
How does this technology compare to existing solutions in terms of cost-effectiveness?
The abstract does not provide information on the cost-effectiveness of this technology compared to existing solutions. Further research or analysis would be needed to address this question.
What impact could this technology have on the overall efficiency of semiconductor manufacturing processes?
The abstract does not discuss the potential impact of this technology on the efficiency of semiconductor manufacturing processes. Additional studies or data would be required to evaluate this aspect.
Original Abstract Submitted
A semiconductor device includes a first semiconductor chip. The first semiconductor chip includes a first semiconductor substrate having a first surface and a second surface opposite to the first surface, and having a first active layer adjacent to the first surface, the first semiconductor substrate having a quadrangle shape from a plan view; a first through electrode penetrating at least a portion of the first semiconductor substrate and connected to the first active layer; a second chip connection pad on the second surface of the first semiconductor substrate and connected to the first through electrode; a first dummy pattern positioned outside the second chip connection pad on the second surface of the first semiconductor substrate from the plan view, the first dummy pattern comprising a line pattern extending horizontally along the second surface of the first semiconductor substrate; and a first chip connection pad on the first surface of the first semiconductor substrate and connected to the first through electrode. The first dummy pattern is disposed adjacent to at least one side of four sides of the quadrangle shape of the first semiconductor substrate from the plan view.
