18368646. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEOK GEUN Ahn of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18368646 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor substrate with redistribution layers, vias, and a circuit layer. The circuit layer contains a circuit element, a circuit wiring pattern, and a device interlayer dielectric layer.
- The semiconductor package consists of a semiconductor substrate with redistribution layers, vias, and a circuit layer.
- The circuit layer within the semiconductor package contains a circuit element, a circuit wiring pattern, and a device interlayer dielectric layer.
Potential Applications
This technology could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology helps in improving the electrical connectivity and performance of semiconductor devices by providing a more efficient and reliable circuit layout.
Benefits
The benefits of this technology include enhanced electrical connectivity, improved performance, and increased reliability of semiconductor devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for manufacturing advanced electronic devices with higher performance and reliability.
Possible Prior Art
One possible prior art could be the use of redistribution layers and vias in semiconductor packaging to improve electrical connectivity and performance of devices.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods?
This article does not provide a direct comparison to existing semiconductor packaging methods, leaving the reader to wonder about the specific advantages or disadvantages of this technology in comparison to others.
What are the specific electronic devices that could benefit the most from this technology?
The article does not mention specific electronic devices that could benefit the most from this technology, leaving the reader to speculate on the potential applications in different industries or products.
Original Abstract Submitted
A semiconductor package includes; a semiconductor substrate including a device region and an edge region, a first redistribution layer on a lower surface of the semiconductor substrate, a second redistribution layer on an upper surface of the semiconductor substrate, through vias vertically penetrating the semiconductor substrate in the edge region to electrically connect the first redistribution layer and the second redistribution layer, and a circuit layer between the lower surface of the semiconductor substrate and the first redistribution layer. The circuit layer may include; a circuit element on the lower surface of the semiconductor substrate, a circuit wiring pattern electrically connected to the circuit element and the first redistribution layer, and a device interlayer dielectric layer substantially encompassing the circuit element and the circuit wiring pattern, wherein the circuit element and the circuit wiring pattern are disposed in the device region and not in the edge region.
