18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology impact the overall cost of manufacturing electronic devices?
- 1.11 What are the potential challenges or limitations of implementing this technology in real-world applications?
- 1.12 Original Abstract Submitted
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
SEUNGDUK Baek of SUWON-SI (KR)
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18364127 titled 'MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a package substrate with a first pad, a first memory device with stacked semiconductor chips, and a chip connecting member to connect the chips to the substrate. The first semiconductor chip has a cell structure, a peripheral circuit structure, a bonding pad, and an input/output pad connected to the substrate. The second semiconductor chip has a cell structure and a bonding pad connected to the first bonding pad. A part of the peripheral circuit structure protrudes from the second chip's sidewall without overlapping it.
- Package substrate with first pad
- First memory device with stacked semiconductor chips
- Chip connecting member for electrical connection
- First semiconductor chip with cell and peripheral circuit structures
- Second semiconductor chip with cell structure and bonding pad
- Protruding peripheral circuit structure from second chip's sidewall
Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring compact and efficient semiconductor packaging, such as smartphones, tablets, laptops, and other portable electronic devices.
Problems Solved
This technology solves the problem of efficiently stacking multiple semiconductor chips in a vertical direction while ensuring proper electrical connections and minimizing space usage within the package substrate.
Benefits
The benefits of this technology include increased memory capacity in a compact form factor, improved electrical connectivity between stacked chips, and enhanced overall performance of electronic devices utilizing this semiconductor package design.
Potential Commercial Applications
- "Innovative Semiconductor Package Design for Enhanced Device Performance"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques involving stacked chips and efficient electrical connections within a compact form factor. Further research and analysis would be needed to identify specific examples of prior art in this field.
Unanswered Questions
How does this technology impact the overall cost of manufacturing electronic devices?
The cost implications of implementing this semiconductor packaging technology in mass production are not addressed in the patent application. Further analysis would be needed to determine the cost-effectiveness of this design compared to existing packaging methods.
What are the potential challenges or limitations of implementing this technology in real-world applications?
The patent application does not discuss any potential challenges or limitations that may arise when implementing this semiconductor packaging design in practical electronic devices. Further research and testing would be necessary to identify and address any such issues that could affect the performance or reliability of the technology.
Original Abstract Submitted
A semiconductor package includes a package substrate including a first pad; a first memory device arranged on the package substrate and including first and second semiconductor chips stacked in a vertical direction; and a first chip connecting member electrically connecting the first semiconductor chip to the package substrate. The first semiconductor chip includes a first cell structure; a first peripheral circuit structure; a first bonding pad; and a first input/output pad electrically connected to the first pad of the package substrate through the first chip connection member. The second semiconductor chip includes a second cell structure; and a second bonding pad connected to the first bonding pad. A part of the first peripheral circuit structure protrudes from a sidewall of the second semiconductor chip so as not to overlap the second semiconductor chip.
