18363957. FILM FORMING APPARATUS, FILM FORMING METHOD, MANUFACTURING METHOD OF ARTICLE, AND STORAGE MEDIUM simplified abstract (CANON KABUSHIKI KAISHA)
Contents
FILM FORMING APPARATUS, FILM FORMING METHOD, MANUFACTURING METHOD OF ARTICLE, AND STORAGE MEDIUM
Organization Name
Inventor(s)
SHINTARO Narioka of Tochigi (JP)
FILM FORMING APPARATUS, FILM FORMING METHOD, MANUFACTURING METHOD OF ARTICLE, AND STORAGE MEDIUM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18363957 titled 'FILM FORMING APPARATUS, FILM FORMING METHOD, MANUFACTURING METHOD OF ARTICLE, AND STORAGE MEDIUM
Simplified Explanation
The patent application describes a film forming apparatus that inhibits the curing of a curable composition while maintaining fillability.
- Film forming operation unit brings a mold into contact with curable composition on a substrate
- Exposure unit exposes the curable composition
- Moving unit moves the substrate between the film forming operation unit and exposure unit
- Control unit increases concentration of gas that inhibits curing during exposure of the curable composition
Potential applications of this technology:
- Manufacturing of electronic components
- 3D printing
- Medical device manufacturing
Problems solved by this technology:
- Preventing premature curing of curable compositions
- Ensuring fillability of molds with curable compositions
Benefits of this technology:
- Improved control over curing process
- Enhanced quality of finished products
- Increased efficiency in manufacturing processes
Original Abstract Submitted
To suitably inhibit the curing of the protruding curable composition without impairing the fillability, a film forming apparatus comprises: a film forming operation unit configured to bring a mold into contact with a curable composition supplied to a substrate; an exposure unit configured to expose the curable composition; a moving unit configured to move the substrate from the film forming operation unit to the exposure unit; and a control unit configured to perform control such that a concentration of a first gas that inhibits curing of the curable composition becomes higher in a state in which the curable composition is exposed by the exposure unit after the substrate is moved by the moving unit than in a state in which the mold is brought into contact with the curable composition by the film forming operation unit.
