18360209. METHOD AND COMPUTING DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
METHOD AND COMPUTING DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
METHOD AND COMPUTING DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18360209 titled 'METHOD AND COMPUTING DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The disclosed patent application describes a method for fabricating a semiconductor device using machine learning-based process proximity correction (PPC) and optical proximity correction (OPC). Here is a simplified explanation of the abstract:
- The method starts by receiving a first layout, which includes patterns for fabricating the semiconductor device.
- Machine learning-based PPC is performed on the first layout. This involves analyzing the features of the patterns in the layout to generate a second layout.
- Optical proximity correction (OPC) is then performed on the second layout to generate a third layout.
Potential applications of this technology:
- Semiconductor manufacturing: The method can be applied in the fabrication of various semiconductor devices, such as integrated circuits, microprocessors, memory chips, and sensors.
- Electronics industry: The technology can be used in the production of electronic components and devices, improving their performance and reliability.
Problems solved by this technology:
- Pattern accuracy: By using machine learning-based PPC and OPC, the method addresses the challenge of achieving precise and accurate patterns in semiconductor fabrication.
- Manufacturing yield: The technology helps improve the yield of semiconductor manufacturing by reducing defects and errors in the fabrication process.
Benefits of this technology:
- Enhanced fabrication accuracy: By incorporating machine learning and optical proximity correction, the method improves the accuracy and precision of pattern fabrication in semiconductor devices.
- Increased manufacturing yield: The technology helps increase the yield of semiconductor manufacturing, resulting in higher productivity and reduced costs.
- Time and cost savings: By automating the process proximity correction using machine learning, the method reduces the need for manual intervention, saving time and resources in the fabrication process.
Original Abstract Submitted
Disclosed is a method for fabricating of a semiconductor device. The method includes receiving a first layout including patterns for the fabrication of the semiconductor device, performing machine learning-based process proximity correction (PPC) based on features of the patterns of the first layout to generate a second layout, and performing optical proximity correction (OPC) on the second layout to generate a third layout.
