18359298. PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST simplified abstract (Apple Inc.)
Contents
- 1 PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST
Organization Name
Inventor(s)
Krishna Prasad Vummidi Murali of Sunnyvale CA (US)
PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359298 titled 'PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST
Simplified Explanation
The semiconductor component package described in the abstract includes circuitry that serves dual purposes: mitigating radio-frequency interference of signals in the package and performing self-test procedures of components in the package. The circuitry consists of chokes positioned between the I/O pads of the package and a sensor module within the package to reduce high-frequency RF interference and safeguard sensors. During self-test procedures, the chokes can be decoupled from the I/O pads and the sensor module and connected between a current source and ground to raise the package's temperature. High-resistance windings in the chokes enhance heat generation during the self-test procedure.
- Chokes are placed between I/O pads and a sensor module to reduce RF interference and protect sensors.
- Chokes can be disconnected from I/O pads and sensor module during self-test procedures to raise package temperature.
- High-resistance windings in chokes increase heat generation during self-test procedures.
Potential Applications
The technology described in the patent application could be applied in various industries where semiconductor components are used, such as automotive, aerospace, and consumer electronics.
Problems Solved
1. Mitigating radio-frequency interference in semiconductor component packages. 2. Performing self-test procedures efficiently and effectively.
Benefits
1. Improved signal integrity within the package. 2. Enhanced protection for sensors. 3. Efficient self-test procedures for components.
Potential Commercial Applications
"Semiconductor Component Package with RF Interference Mitigation and Self-Test Capabilities" could find applications in industries requiring reliable and high-performance semiconductor components, such as telecommunications, medical devices, and industrial automation.
Possible Prior Art
One possible prior art could be semiconductor packages with basic RF interference mitigation techniques but lacking the self-test capabilities described in this patent application.
Unanswered Questions
How does the circuitry handle different types of sensors within the package?
The abstract does not specify how the circuitry adapts to various sensor types and their specific requirements during self-test procedures.
What impact does the increased heat generation during self-test procedures have on the overall reliability of the package?
The abstract does not address the potential effects of elevated temperatures on the long-term reliability of the semiconductor component package.
Original Abstract Submitted
A semiconductor component package includes circuitry that can be used both for mitigating radio-frequency interference of signals in the package and for performing self-test procedures of components in the package. The circuitry includes chokes between the I/O pads of the package and a sensor module in the package to attenuate high-frequency RF interference in the package and protect sensors in the package. Each I/O pad may have a corresponding choke. During a self-test procedure, such as a test of a sensor's temperature coefficient of offset, the chokes can be decoupled from the I/O pads and the sensor module and coupled between a current source and a ground. A current can be supplied to the choke to raise the temperature of the package. The chokes may use high-resistance windings to increase heat generation during the self-test procedure.
