18358131. RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD OF MANUFACTURING RADIATION IMAGING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD OF MANUFACTURING RADIATION IMAGING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD OF MANUFACTURING RADIATION IMAGING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD OF MANUFACTURING RADIATION IMAGING APPARATUS
Organization Name
Inventor(s)
TOMOYUKI Oike of Kanagawa (JP)
TAMAKI Kobayashi of Kanagawa (JP)
RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD OF MANUFACTURING RADIATION IMAGING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18358131 titled 'RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD OF MANUFACTURING RADIATION IMAGING APPARATUS
Simplified Explanation
The patent application describes a radiation imaging apparatus with a sensor substrate and a scintillator bonded by a bonding member. The scintillator has multiple protective layers on different surfaces.
- Sensor substrate and scintillator bonded by a bonding member
- Scintillator has first, second, and third surfaces with protective layers
- Protective layers are made up of one or more layers
- Number of layers in first protective layer is less than or equal to second and third protective layers
Potential Applications
- Medical imaging
- Industrial inspection
- Security screening
Problems Solved
- Enhanced durability of scintillator
- Improved image quality
- Better radiation detection accuracy
Benefits
- Increased longevity of imaging apparatus
- Higher quality images
- More reliable radiation detection
Original Abstract Submitted
A radiation imaging apparatus in which a sensor substrate and a scintillator are bonded by a bonding member, is provided. The scintillator includes a first surface opposing the sensor substrate via the bonding member and covered by a first protective layer, a second surface disposed on an opposite side of the first surface and covered by a second protective layer, and a third surface connecting the first surface and the second surface and covered by a third protective layer. The first protective layer, the second protective layer, and the third protective layer are each configured by one or more layers, and a number of layers of the first protective layer is less than or equal to respective numbers of layers of the second protective layer and the third protective layer.
