18340101. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGES
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Jin Kyeong Seol of Suwon-si (KR)
Hyuek Jae Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18340101 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the patent application includes a first semiconductor die with a memory, a second semiconductor die with a memory, a dummy die without a memory but with a heat sink made of metal material, and a mold film covering all components. The heat sink decreases in width away from the top surface of the dummy die and has curved side surfaces.
- First semiconductor die with memory
- Second semiconductor die with memory
- Dummy die without memory but with heat sink
- Heat sink made of metal material
- Mold film covering all components
- Heat sink width decreases away from top surface of dummy die
- Curved side surfaces of heat sink
Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring efficient heat dissipation, such as computers, smartphones, and servers.
Problems Solved
This innovation addresses the issue of heat buildup in semiconductor devices, which can affect performance and longevity. By incorporating a heat sink with a unique design, the package helps dissipate heat effectively.
Benefits
- Improved thermal management - Enhanced performance and reliability of semiconductor devices - Potential for smaller form factors due to efficient heat dissipation
Potential Commercial Applications
- "Innovative Heat Sink Design for Semiconductor Packages"
Possible Prior Art
There may be prior art related to heat sink designs for semiconductor packages, but without specific details, it is challenging to identify relevant examples.
Unanswered Questions
How does the heat sink design impact the overall size of the semiconductor package?
The patent application mentions that the heat sink width decreases away from the top surface of the dummy die, but it does not provide information on how this design choice affects the overall dimensions of the package.
What materials are commonly used in heat sinks for semiconductor packages, and how does the metal material used in this innovation compare to them?
The patent application highlights the use of a metal material in the heat sink, but it does not elaborate on the specific type of metal or how it compares to traditional materials used in heat sinks for semiconductor packages.
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package comprises a first semiconductor die including a memory, a second semiconductor die including a memory and on the first semiconductor die, a dummy die on the semiconductor device and not including a memory, a heat sink on the dummy die and including a metal material and a mold film on side surfaces of each of the first semiconductor die, the second semiconductor die, the dummy die, and the heat sink. A width of the heat sink may decrease away from a top surface of the dummy die, and side surfaces of the heat sink may be curved.
