18331975. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
DAESEOK Byeon of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18331975 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application includes a structure where multiple chips are stacked, with features such as a chip area, scribe lane, dam structure, detection wire, and detection circuit to identify defects in the scribe lane.
- The semiconductor device has a chip area where multiple chips are stacked.
- A scribe lane is located at the circumference of the chip area.
- A dam structure separates the chip area and the scribe lane.
- A detection wire extends from the chip area to the scribe lane through the dam structure.
- A detection circuit in the chip area is connected to the detection wire and can detect defects in the scribe lane.
Potential Applications
This technology could be used in the manufacturing of semiconductor devices to improve quality control and defect detection processes.
Problems Solved
This innovation helps in identifying defects in the scribe lane of stacked chips, which can improve overall product quality and reliability.
Benefits
The technology allows for more efficient defect detection in semiconductor devices, leading to higher quality products and potentially reducing manufacturing costs.
Potential Commercial Applications
"Improving Quality Control in Semiconductor Manufacturing with Stacked Chip Defect Detection Technology"
Possible Prior Art
There may be prior art related to defect detection in semiconductor devices, but specific examples are not provided in the patent application.
Unanswered Questions
How does this technology compare to existing defect detection methods in semiconductor manufacturing?
This article does not provide a direct comparison to existing defect detection methods in semiconductor manufacturing. Further research or information would be needed to make a comparison.
What impact could this technology have on the overall efficiency of semiconductor manufacturing processes?
The article does not discuss the potential impact of this technology on the efficiency of semiconductor manufacturing processes. Additional studies or data would be required to assess this impact.
Original Abstract Submitted
A semiconductor device with a structure in which a plurality of chips are stacked includes: a chip area; a scribe lane at a circumference of the chip area; a dam structure that separates the chip area and the scribe lane; a detection wire that extends from the chip area to the scribe lane by passing through the dam structure; and a detection circuit in the chip area that is electrically connected to the detection wire and is configured to detect a defect in the scribe lane.
