18323754. ANTENNA MODULE FOR VEHICLE AND VEHICLE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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ANTENNA MODULE FOR VEHICLE AND VEHICLE INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Hyunggon Kim of Suwon-si (KR)

Daeyoung Oh of Suwon-si (KR)

Jeseung Oh of Suwon-si (KR)

Jeonghoon Lee of Suwon-si (KR)

ANTENNA MODULE FOR VEHICLE AND VEHICLE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18323754 titled 'ANTENNA MODULE FOR VEHICLE AND VEHICLE INCLUDING THE SAME

Simplified Explanation

The abstract describes an antenna device for a vehicle that includes a printed circuit board (PCB) with antenna arrays, radio frequency integrated circuits (RFICs), and an intermediate frequency integrated circuit (IFIC).

  • The antenna device includes multiple antenna arrays arranged on one surface of the PCB.
  • The RFICs are placed on the opposite surface of the PCB and are electrically connected to the antenna arrays.
  • An IFIC is also located on the same surface as the RFICs but at a distance from each RFIC, and it is electrically connected to the RFICs.

Potential Applications:

  • Automotive industry for vehicle communication systems.
  • Wireless communication systems in other vehicles or devices.

Problems Solved:

  • Efficient communication within a vehicle.
  • Space-saving design for antenna and RF components.

Benefits:

  • Improved signal reception and transmission.
  • Compact design for easy integration into vehicles.
  • Cost-effective solution for vehicle communication systems.


Original Abstract Submitted

An antenna device for a vehicle and a vehicle including the same are provided. The antenna device includes a printed circuit board (PCB), a plurality of antenna arrays arranged on a first surface of the PCB, a plurality of radio frequency integrated circuits (RFICs) arranged on a second surface of the PCB and electrically connected to the plurality of antenna arrays, and an intermediate frequency integrated circuit (IFIC) arranged on the second surface of the PCB to be apart from each of the plurality of RFICs by a same distance, the IFIC being electrically connected to the plurality of RFICs.