18312191. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Jong Youn Kim of Suwon-si (KR)
Hyeon Seok Lee of Suwon-si (KR)
Seok Kyu Choi of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18312191 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes several components: a redistribution substrate, a semiconductor chip, a silicon capacitor, solder balls, and a metal pattern.
- The redistribution substrate is a platform with a first side and a second side.
- The semiconductor chip is mounted on the first side of the redistribution substrate.
- A silicon capacitor is located on the second side of the redistribution substrate.
- A plurality of solder balls are positioned on the second side of the redistribution substrate, adjacent to the silicon capacitor.
- A metal pattern is embedded within the redistribution substrate, positioned between the silicon capacitor and the solder balls.
- The metal pattern consists of a first portion extending in one direction and a second portion connected to the first portion, extending in a different direction.
Potential applications of this technology:
- Semiconductor packaging for electronic devices such as smartphones, tablets, and computers.
- Integrated circuits and microprocessors.
- Power electronics and automotive electronics.
Problems solved by this technology:
- Improved electrical performance and reliability of semiconductor packages.
- Efficient redistribution of electrical signals within the package.
- Enhanced thermal management and heat dissipation.
Benefits of this technology:
- Higher integration density and miniaturization of electronic devices.
- Improved signal integrity and reduced electromagnetic interference.
- Enhanced power efficiency and performance of semiconductor devices.
Original Abstract Submitted
A semiconductor package includes a redistribution substrate having a first side and an opposite second side, a semiconductor chip on the first side of the redistribution substrate, a silicon capacitor on the second side of the redistribution substrate, a plurality of solder balls on the second side of the redistribution substrate and adjacent the silicon capacitor, and a metal pattern in the redistribution substrate and positioned between the silicon capacitor and the solder balls. The metal pattern includes a first portion extending in a first direction, and a second portion connected to the first portion and extending in a second direction different from the first direction.
