18310194. IMAGE SENSOR simplified abstract (Samsung Electronics Co., Ltd.)
Contents
IMAGE SENSOR
Organization Name
Inventor(s)
Byeongtaek Bae of Suwon-si (KR)
IMAGE SENSOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18310194 titled 'IMAGE SENSOR
Simplified Explanation
The patent application describes an image sensor with micro lenses on one surface and interconnection lines on the other surface of a substrate, with a pixel isolation portion to prevent direct contact between pixels. The pixel isolation portion includes an insulating isolation pattern and a conductive pattern, where the conductive pattern is spaced apart from the substrate and the insulating isolation pattern.
- Image sensor with micro lenses and interconnection lines on opposite surfaces of a substrate
- Pixel isolation portion to prevent direct contact between pixels
- Insulating isolation pattern and conductive pattern in the pixel isolation portion
- Conductive pattern includes a sequential arrangement of first, second, and third conductive patterns on a side surface of the insulating isolation pattern
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- Potential Applications
- Digital cameras
- Smartphones
- Surveillance cameras
- Medical imaging devices
- Problems Solved
- Preventing crosstalk between pixels
- Improving image quality and resolution
- Enhancing overall performance of image sensors
- Benefits
- Higher quality images
- Increased pixel isolation
- Improved performance and reliability of image sensors
Original Abstract Submitted
An image sensor may include a substrate having a first surface and a second surface, which are opposite to each other, and micro lenses on the second surface, interconnection lines on the first surface, and a pixel isolation portion in the substrate, the pixel isolation portion configured to isolate pixels from direct contact with each other. The pixel isolation portion may include an insulating isolation pattern and a conductive pattern, wherein the conductive pattern is spaced apart from the substrate, and the insulating isolation pattern is between the substrate and the conductive pattern. The conductive pattern may include a sequential arrangement of a first conductive pattern, a second conductive pattern, and a third conductive pattern on a side surface of the insulating isolation pattern.
