18309113. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Hwan Young Choi of Suwon-si (KR)
Seok Hyun Lee of Suwon-si (KR)
Seok Geun Ahn of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18309113 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes two semiconductor chips with pads on their surfaces, where the second chip has a convex bottom surface. The pads on the second chip are connected to the pads on the first chip.
- First semiconductor chip with pads on top surface
- Second semiconductor chip with pads on bottom surface
- Pads on second chip connected to pads on first chip
- Convex bottom surface on second chip
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- Potential Applications
- Semiconductor packaging
- Integrated circuits
- Electronics manufacturing
- Problems Solved
- Efficient connection between semiconductor chips
- Improved thermal management
- Enhanced electrical performance
- Benefits
- Higher reliability
- Increased functionality
- Better overall performance
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip having a first top surface and an opposite first bottom surface, first pads on the first top surface, each having a first width and a first height, second pads on the first top surface further outward from a center of the first semiconductor chip, each having a second width less than the first width and a second height greater than the first height. The semiconductor package further includes a second semiconductor chip having a second bottom surface which faces the first top surface and an opposite second top surface, third pads on the second bottom surface which are connected to the first pads, and fourth pads on the second bottom surface which are connected to the second pads. The second bottom surface is convex.
