18309070. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Jun Woo Myung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18309070 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a first redistribution structure, a first semiconductor chip with two surfaces, a second redistribution structure on the second surface of the first chip, a first sealing layer between the redistribution structures, and a connection structure to connect them. The second redistribution structure has a second insulating layer, a second redistribution layer, and a first via and a second via on the first via. The first via has first and second seed layers and a conductive layer, while the first sealing layer includes a photosensitive insulating material.
- The semiconductor package includes a first redistribution structure and a first semiconductor chip with two surfaces.
- A second redistribution structure is present on the second surface of the first chip, consisting of a second insulating layer and a second redistribution layer.
- A first sealing layer is placed between the first and second redistribution structures, covering the second surface of the first chip.
- A connection structure is used to connect the first and second redistribution structures.
- The second redistribution layer contains a first via and a second via on top of the first via.
- The first via consists of first and second seed layers and a conductive layer.
- The first sealing layer is made of a photosensitive insulating material.
Potential applications of this technology:
- Semiconductor packaging for electronic devices
- Integrated circuits and microchips
- Consumer electronics and mobile devices
Problems solved by this technology:
- Efficient redistribution of signals and connections within a semiconductor package
- Improved insulation and protection of the semiconductor chip
- Enhanced reliability and performance of electronic devices
Benefits of this technology:
- Higher integration density and miniaturization of electronic components
- Improved electrical performance and signal transmission
- Enhanced reliability and durability of semiconductor packages
Original Abstract Submitted
Provided is a semiconductor package. The semiconductor package may include a first redistribution structure, a first semiconductor chip including a first surface and a second surface, the first surface being disposed to face the first redistribution structure, a second redistribution structure disposed on the second surface of the first semiconductor chip and including a second insulating layer and a second redistribution layer, a first sealing layer disposed between the first and second redistribution structures and configured to cover the second surface of the first semiconductor chip, and a connection structure configured to connect the first and the second redistribution structures, wherein the second redistribution layer includes a first via and a second via on the first via, wherein the first via includes first and second seed layers, and a conductive layer on the second seed layer, and wherein the first sealing layer includes a photosensitive insulating material.
