18301575. VERTICAL MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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VERTICAL MEMORY DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jeawon Jeong of Suwon-Si (KR)

Dongha Shin of Suwon-Si (KR)

Bongsoon Lim of Suwon-Si (KR)

VERTICAL MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18301575 titled 'VERTICAL MEMORY DEVICE

Simplified Explanation

The memory device described in the abstract includes word line patterns stacked on a substrate, a channel structure, and first and second contact plugs extending in the vertical direction. The word line patterns are on the cell area and cell wiring area, extending to the cell wiring area parallel to the substrate's upper surface. The first contact plugs are on the cell wiring area, each electrically connected to a corresponding word line pattern and insulated from other word line patterns. The second contact plugs are on the through-hole wiring area.

  • Word line patterns stacked on substrate
  • Channel structure and contact plugs in vertical direction
  • Different areas on substrate for cell, cell wiring, and through-hole wiring
  • First contact plugs connected to word line patterns on cell wiring area
  • Second contact plugs on through-hole wiring area

Potential Applications

The technology described in the patent application could be applied in:

  • Memory devices
  • Semiconductor manufacturing
  • Data storage systems

Problems Solved

This technology helps in:

  • Improving memory device efficiency
  • Enhancing data storage capacity
  • Streamlining semiconductor manufacturing processes

Benefits

The benefits of this technology include:

  • Increased memory device performance
  • Higher data storage density
  • Enhanced reliability and durability

Potential Commercial Applications

The potential commercial applications of this technology could be in:

  • Consumer electronics
  • Computer hardware
  • Data centers

Possible Prior Art

One possible prior art for this technology could be:

  • Stacked memory devices with vertical channel structures

Unanswered Questions

How does this technology compare to existing memory device designs?

This article does not provide a direct comparison with existing memory device designs to showcase the advantages of the described technology.

What specific manufacturing processes are involved in creating this memory device?

The article does not delve into the detailed manufacturing processes involved in creating the memory device described in the patent application.


Original Abstract Submitted

A memory device may include word line patterns stacked on a substrate and spaced from each other in a vertical direction, a channel structure extending in the vertical direction, and first contact plugs and second contact plugs extending in the vertical direction. The substrate may include a cell area, a cell wiring area, and a through-hole wiring area. The word line patterns may be on the cell area and the cell wiring area and may extend to the cell wiring area in a direction parallel to an upper surface of the substrate. The first contact plugs may be on the cell wiring area and each may be electrically connected with a corresponding one of the word line patterns and insulated from remaining word line patterns other than the corresponding one of the word line patterns. The second contact plugs may be on the through-hole wiring area.