18273101. COIL SUBSTRATE simplified abstract (LG ELECTRONICS INC.)

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COIL SUBSTRATE

Organization Name

LG ELECTRONICS INC.

Inventor(s)

Byeong Geuk Kang of Seoul (KR)

Younseok Jang of Seoul (KR)

COIL SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18273101 titled 'COIL SUBSTRATE

Simplified Explanation

The present specification describes a coil substrate with a unique design where the innermost turn of the coil has a greater number of patterns compared to the outermost turn.

  • The coil substrate comprises a substrate and a coil mounted on one surface of the substrate.
  • The coil consists of a plurality of turns, including a first inner turn at the innermost side and a first outer turn at the outermost side.
  • The first inner turn has a higher number of patterns than the first outer turn.

Potential Applications

This technology could be applied in:

  • Wireless charging systems
  • RFID technology
  • Inductive heating systems

Problems Solved

  • Improved efficiency in energy transfer
  • Enhanced performance in wireless communication devices
  • Better heat distribution in inductive heating applications

Benefits

  • Increased energy transfer efficiency
  • Enhanced performance and reliability
  • Improved heat distribution and control

Potential Commercial Applications

Optimizing Coil Substrate Design for Enhanced Performance

Possible Prior Art

There may be prior art related to coil substrates with varying turn patterns, but specific examples are not provided in this abstract.

Unanswered Questions

How does the design of the coil substrate impact its overall performance in different applications?

The abstract mentions a unique design feature of the coil substrate, but it does not elaborate on how this design affects the performance of the substrate in various applications.

Are there any specific industries or technologies that would benefit the most from this innovative coil substrate design?

While potential applications are mentioned, it is not clear which industries or technologies would see the most significant advantages from implementing this technology.


Original Abstract Submitted

The present specification relates to a coil substrate. A coil substrate according to one embodiment of the present specification comprises: a substrate; and a coil which is mounted on one surface of the substrate and comprises a plurality of turns, wherein the plurality of turns comprise a first inner turn located at the innermost side of the coil and a first outer turn located at the outermost side of the coil, wherein the first inner turn comprises a greater number of patterns than the first outer turn.