18264947. SEMICONDUCTOR DEVICE simplified abstract (Sony Semiconductor Solutions Corporation)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Sony Semiconductor Solutions Corporation
Inventor(s)
Tetsuya Sugimoto of Kumamoto (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18264947 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
- Semiconductor device designed to prevent peeling of sealing resin
- Includes substrate, frame with annular wall and projection portions, groove portions on wall, semiconductor chip, and lid portion
- Semiconductor chip is sealed by the lid portion on the frame
Potential Applications
This technology can be applied in various electronic devices such as smartphones, tablets, and computers.
Problems Solved
Prevents peeling of sealing resin which can lead to damage to the semiconductor chip and affect the performance of the device.
Benefits
- Improved reliability and durability of the semiconductor device - Enhanced protection for the semiconductor chip - Increased lifespan of the electronic device
Original Abstract Submitted
The present disclosure provides a semiconductor device capable of suppressing peeling of sealing resin, and an electric device. A semiconductor device according to a first aspect of the present disclosure includes: a substrate; a frame having a wall portion that is annularly arranged on the substrate and has a plurality of projection portions on an upper surface, the frame having a groove portion provided on the upper surface of the wall portion in correspondence to each of the projection portions; a semiconductor chip arranged in a region surrounded by the wall portion on the substrate; and a lid portion arranged on the upper surface of the wall portion and sealing the semiconductor chip.
