18264833. PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD simplified abstract (RESONAC CORPORATION)
Contents
- 1 PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD
Organization Name
Inventor(s)
Shunsuke Kurahashi of Tokyo (JP)
Yoshishige Okuno of Tokyo (JP)
PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18264833 titled 'PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD
Simplified Explanation
The patent application proposes a heating element configuration that can maintain heat dissipation performance when the configuration of a thermally conductive member is changed. The device includes units for calculating reference and comparative heat dissipation performance, generating a proposed model, and outputting information based on the proposed model.
- The reference performance calculation unit calculates heat dissipation performance based on a reference model representing a configuration of a semiconductor device with a multi-layered thermally conductive member including a heating element.
- The comparative performance calculation unit calculates heat dissipation performance based on a comparative model where the configuration of the thermally conductive member is changed from the reference model.
- The proposed configuration generation unit generates a proposed model where the configuration of the heating element is changed in the comparative model to achieve equivalent heat dissipation performance as the reference model.
- The result output unit outputs information based on the proposed model.
Potential Applications
The technology can be applied in various electronic devices where heat dissipation is critical, such as computers, smartphones, and automotive electronics.
Problems Solved
This innovation addresses the challenge of maintaining heat dissipation performance when the configuration of a thermally conductive member is altered in electronic devices.
Benefits
- Improved heat dissipation performance - Enhanced reliability of electronic devices - Cost-effective solution for thermal management
Potential Commercial Applications
The technology can be utilized in the manufacturing of electronic devices to optimize heat dissipation performance, leading to more efficient and reliable products.
Possible Prior Art
Prior art related to optimizing heat dissipation performance in electronic devices through configuration changes in thermally conductive members may exist, but specific examples are not provided in this patent application.
Unanswered Questions
How does this technology compare to existing solutions for heat dissipation in electronic devices?
The article does not provide a direct comparison with existing solutions or technologies in the field of heat dissipation in electronic devices.
What are the specific industries or sectors that could benefit the most from this technology?
The article does not specify the industries or sectors that could potentially benefit the most from the proposed heating element configuration.
Original Abstract Submitted
A heating element configuration that can maintain heat dissipation performance when a configuration of a thermally conductive member is changed is proposed. A proposal device includes a reference performance calculation unit that calculates heat dissipation performance based on a reference model representing a configuration of a semiconductor device with a multi-layered thermally conductive member includes a heating element; a comparative performance calculation unit that calculates heat dissipation performance based on a comparative model in which a configuration of the thermally conductive member of the reference model is changed; a proposed configuration generation unit that generates a proposed model in which a configuration of the heating element of the comparative model is changed such that the heat dissipation performance based on the comparative model is equivalent to the heat dissipation performance based on the reference model; and a result output unit that outputs information based on the proposed model.
