18240957. SEMICONDUCTOR TEST DEVICE AND SYSTEM AND TEST METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR TEST DEVICE AND SYSTEM AND TEST METHOD USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Meehyun Lim of Seoul (KR)

Sungyeol Kim of Yongin-si (KR)

Hyungjung Yong of Seongnam-si (KR)

Jinyeong Yun of Yongin-si (KR)

SEMICONDUCTOR TEST DEVICE AND SYSTEM AND TEST METHOD USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18240957 titled 'SEMICONDUCTOR TEST DEVICE AND SYSTEM AND TEST METHOD USING THE SAME

Simplified Explanation

The abstract describes a test method for a semiconductor device that involves detecting contact failure between two semiconductor chips during assembly of a semiconductor package. The method utilizes a test circuit embedded in the first semiconductor chip to determine if the package is defective after assembly.

• The test method is used to identify contact failure between two semiconductor chips during the assembly process of a semiconductor package.
• A test circuit embedded in the first semiconductor chip is utilized to detect the contact failure.
• The test circuit is also used after the assembly of the semiconductor package to determine if the package is defective.
• The method helps in identifying and preventing contact failures in semiconductor packages, ensuring their quality and reliability.

Potential Applications

• Semiconductor manufacturing industry
• Electronics manufacturing industry
• Integrated circuit (IC) production

Problems Solved

• Detection of contact failure between semiconductor chips during assembly
• Ensuring the quality and reliability of semiconductor packages

Benefits

• Early detection of contact failures during assembly helps prevent defective semiconductor packages from being shipped.
• Improved quality control in semiconductor manufacturing.
• Increased reliability of semiconductor packages.

Original Abstract Submitted

A test method for a semiconductor device includes determining a contact failure between a first semiconductor chip and a second semiconductor chip during assembly of a semiconductor package including the first semiconductor chip and the second semiconductor chip, using a test circuit embedded in the first semiconductor chip, and after the assembly of the semiconductor package, determining whether the semiconductor package is defective by using the test circuit.