18240007. SUBSTRATE PROCESSING APPARATUS AND METHOD simplified abstract (SEMES CO., LTD.)

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SUBSTRATE PROCESSING APPARATUS AND METHOD

Organization Name

SEMES CO., LTD.

Inventor(s)

Hyunjik Jung of Cheonan-si (KR)

Yong Won Kim of Cheonan-si (KR)

SUBSTRATE PROCESSING APPARATUS AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18240007 titled 'SUBSTRATE PROCESSING APPARATUS AND METHOD

Simplified Explanation

The substrate processing apparatus and method described in the patent application aim to prevent suction holes from being clogged due to airflow generated when a substrate is floated and printed. The apparatus includes a substrate stage for supporting the substrate and a treatment liquid ejection device mounted above the substrate stage to eject a treatment liquid onto the substrate. The substrate stage features a floating plate for floating at least a portion of the substrate and an airflow blocking member for blocking airflow flowing into the gap between the substrate and the floating plate.

  • Substrate processing apparatus and method to prevent clogging of suction holes due to airflow during substrate floating and printing.
  • Apparatus includes a substrate stage, treatment liquid ejection device, floating plate, and airflow blocking member.
  • Floating plate supports the substrate while the airflow blocking member prevents airflow from entering the gap between the substrate and the floating plate.

Potential Applications

The technology can be applied in industries such as semiconductor manufacturing, display panel production, and printed electronics.

Problems Solved

Prevents clogging of suction holes during substrate processing, ensuring efficient and uninterrupted operation.

Benefits

Enhanced substrate processing efficiency, reduced maintenance requirements, and improved overall productivity.

Potential Commercial Applications

  • Semiconductor manufacturing
  • Display panel production
  • Printed electronics

Possible Prior Art

There may be prior art related to substrate processing apparatus with floating plates, but specific examples are not provided in the patent application.

Unanswered Questions

How does the airflow blocking member effectively prevent clogging of suction holes?

The patent application mentions the airflow blocking member, but it does not detail the specific design or mechanism through which it achieves its intended purpose.

Are there any alternative methods to prevent clogging of suction holes during substrate processing?

The patent application focuses on the use of a floating plate and an airflow blocking member, but it does not explore other potential solutions or technologies that could address the same issue.


Original Abstract Submitted

Provided is a substrate processing apparatus and method capable of preventing suction holes from being clogged due to airflow generated when a substrate is floated and printed, and the substrate processing apparatus includes a substrate stage for supporting a substrate, and a treatment liquid ejection device mounted above the substrate stage to eject a treatment liquid onto the substrate, wherein the substrate stage includes a floating plate for floating at least a portion of the substrate, and an airflow blocking member for blocking at least a portion of a gap between the substrate and the floating plate to block airflow flowing into the gap.